MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A memory device, comprising:
- a substrate;
a plurality of first gate structures formed on the substrate;
a first dielectric layer formed on top surfaces and sidewalls of the plurality of first gate structures;
a second dielectric layer formed on the first dielectric layer, wherein the second dielectric layer is in direct contact with the first dielectric layer, and the second dielectric layer and the first dielectric layer are made of the same material;
a third dielectric layer formed on the first dielectric layer which is between the plurality of first gate structures, wherein the third dielectric layer defines a plurality of contact holes exposing the substrate; and
a contact plug filling the plurality of contact holes,wherein the memory device comprises an array region and a peripheral region, and the plurality of first gate structures are formed in the array region.
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Accused Products
Abstract
A memory device and a method for manufacturing the memory device are provided. The memory device includes a substrate, a plurality of first gate structures, a first dielectric layer, a second dielectric layer, a third dielectric layer and a contact plug. The first gate structures are formed on an array region of the substrate. The first dielectric layer is formed on top surfaces and sidewalls of the first gate structures. The second dielectric layer is formed on the first dielectric layer and in direct contact with the first dielectric layer. The second dielectric layer and the first dielectric layer are made of the same material. The third dielectric layer is formed between the first gate structures and defines a plurality of contact holes exposing the substrate. The contact plug fills the contact holes.
3 Citations
19 Claims
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1. A memory device, comprising:
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a substrate; a plurality of first gate structures formed on the substrate; a first dielectric layer formed on top surfaces and sidewalls of the plurality of first gate structures; a second dielectric layer formed on the first dielectric layer, wherein the second dielectric layer is in direct contact with the first dielectric layer, and the second dielectric layer and the first dielectric layer are made of the same material; a third dielectric layer formed on the first dielectric layer which is between the plurality of first gate structures, wherein the third dielectric layer defines a plurality of contact holes exposing the substrate; and a contact plug filling the plurality of contact holes, wherein the memory device comprises an array region and a peripheral region, and the plurality of first gate structures are formed in the array region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing a memory device, comprising:
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providing a substrate; forming a plurality of first gate structures on the substrate; forming a first dielectric layer over the substrate and on top surfaces and sidewalls of the plurality of first gate structures, and the first dielectric layer does not fully fill a trench between the plurality of first gate structures; forming a gap-filling dielectric structure on the first dielectric layer and filling the trench with the gap-filling dielectric structure, and the gap-filling dielectric structure and the first dielectric layer are made of different materials, wherein forming the gap-filling dielectric structure comprises a planarization step such that a top surface of the gap-filling dielectric structure is coplanar with a top surface of the first dielectric layer; forming a second dielectric layer on the first dielectric layer and the gap-filling dielectric structure, wherein the second dielectric layer is in direct contact with the first dielectric layer, and the second dielectric layer and the first dielectric layer are made of the same material; performing a first etching process to remove the second dielectric layer and the gap-filling dielectric structure between the plurality of first gate structures; forming a third dielectric layer on the first dielectric layer which is between the plurality of first gate structures, wherein the third dielectric layer defines a plurality of contact holes exposing the substrate; and filling the plurality of contact holes with a conductive material to form a contact plug, wherein the memory device comprises an array region and a peripheral region, and the plurality of first gate structures are formed in the array region. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification