ELECTROSTATIC CHUCK, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE HOLDING METHOD
First Claim
1. An electrostatic chuck comprising:
- a plurality of electrodes configured to generate an electrostatic force for attracting and holding a substrate; and
a surface on which the substrate is to be mounted,wherein the electrodes are arranged respectively in multiple regions radially and circumferentially defined in the electrostatic chuck.
1 Assignment
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Accused Products
Abstract
An electrostatic chuck includes a plurality of electrodes configured to generate an electrostatic force for attracting and holding a substrate and a surface on which the substrate is to be mounted. The electrodes are arranged respectively in multiple regions radially and circumferentially defined in the electrostatic chuck. Further, a substrate processing apparatus includes an electrostatic chuck including a plurality of electrodes configured to generate an electrostatic force for attracting and holding a substrate and a surface on which the substrate is to be mounted; and a controller configured to control a timing of applying a DC voltage to each of the electrodes. Each of the electrodes generates an electrostatic force for attracting and holding the substrate by the DC voltage applied thereto, and the electrodes are arranged respectively in multiple regions radially and circumferentially defined in the electrostatic chuck.
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Citations
20 Claims
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1. An electrostatic chuck comprising:
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a plurality of electrodes configured to generate an electrostatic force for attracting and holding a substrate; and a surface on which the substrate is to be mounted, wherein the electrodes are arranged respectively in multiple regions radially and circumferentially defined in the electrostatic chuck.
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2. A substrate processing apparatus comprising:
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an electrostatic chuck including a plurality of electrodes configured to generate an electrostatic force for attracting and holding a substrate and a surface on which the substrate is to be mounted; and a controller configured to control a timing of applying a DC voltage to each of the electrodes, wherein each of the electrodes generates an electrostatic force for attracting and holding the substrate by the DC voltage applied thereto, and the electrodes are arranged respectively in multiple regions radially and circumferentially defined in the electrostatic chuck. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A substrate holding method for holding a substrate by using an electrostatic chuck,
wherein the electrostatic chuck includes a plurality of electrodes configured to generate an electrostatic force for attracting and holding the substrate and a surface on which the substrate is to be mounted, and the electrodes are arranged respectively in multiple regions radially and circumferentially defined in the electrostatic chuck, and each of the electrodes generates the electrostatic force by a DC voltage applied thereto, the method comprising: controlling a timing of applying the DC voltage to each of the electrodes. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
Specification