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Distributed I/O Interfaces in Modularized Integrated Circuit Devices

  • US 20190319627A1
  • Filed: 06/28/2019
  • Published: 10/17/2019
  • Est. Priority Date: 06/28/2019
  • Status: Active Grant
First Claim
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1. An integrated circuit device, comprising:

  • an interposer;

    a programmable fabric die disposed on the interposer, wherein the programmable fabric die comprises a plurality of microbumps and a plurality of logic element blocks, wherein the plurality of logic element blocks comprise;

    programmable fabric circuitry; and

    a plurality of input/output interfaces distributed among the plurality of logic element blocks, wherein the plurality of input/output interfaces is configured to electrically couple to the plurality of microbumps; and

    a device disposed on the interposer, wherein the device is external to the programmable fabric die and is configured to electrically couple to the plurality of microbumps via the interposer.

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