Distributed I/O Interfaces in Modularized Integrated Circuit Devices
First Claim
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1. An integrated circuit device, comprising:
- an interposer;
a programmable fabric die disposed on the interposer, wherein the programmable fabric die comprises a plurality of microbumps and a plurality of logic element blocks, wherein the plurality of logic element blocks comprise;
programmable fabric circuitry; and
a plurality of input/output interfaces distributed among the plurality of logic element blocks, wherein the plurality of input/output interfaces is configured to electrically couple to the plurality of microbumps; and
a device disposed on the interposer, wherein the device is external to the programmable fabric die and is configured to electrically couple to the plurality of microbumps via the interposer.
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Abstract
An integrated circuit device is disclosed that includes an interposer and a programmable fabric die disposed on the interposer. The programmable fabric die includes multiple sectors that each have multiple rows of logic element blocks. Each row of logic element blocks includes multiple microbumps. Each logic element block has programmable fabric circuitry and an input/output interface electrically coupled to a respective microbump. The integrated circuit device also includes a device disposed on the interposer external to the programmable fabric die and electrically coupled to the microbumps via the interposer.
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Citations
22 Claims
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1. An integrated circuit device, comprising:
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an interposer; a programmable fabric die disposed on the interposer, wherein the programmable fabric die comprises a plurality of microbumps and a plurality of logic element blocks, wherein the plurality of logic element blocks comprise; programmable fabric circuitry; and a plurality of input/output interfaces distributed among the plurality of logic element blocks, wherein the plurality of input/output interfaces is configured to electrically couple to the plurality of microbumps; and a device disposed on the interposer, wherein the device is external to the programmable fabric die and is configured to electrically couple to the plurality of microbumps via the interposer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A programmable fabric die comprising:
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a plurality of microbumps disposed on a bottom surface of the programmable fabric die; a plurality of logic element blocks; and a plurality of input/output interfaces distributed among the plurality of logic element blocks, wherein the plurality of input/output interfaces is configured to electrically couple to the plurality of microbumps. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A programmable fabric die comprising:
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a plurality of microbumps; and a plurality of sectors comprising a plurality of rows of logic element blocks, wherein the plurality of rows of logic element blocks comprises; programmable fabric circuitry; a plurality of input/output interfaces distributed among the plurality of rows of logic element blocks, wherein the plurality of input/output interfaces is configured to electrically couple to the plurality of microbumps; and repair logic configured to reroute an incoming signal from a microbump of the plurality of microbumps to a second row of logic element blocks of the plurality of rows of logic element blocks when a first row of logic element blocks of the plurality of rows of logic element blocks is determined to be faulty. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification