ELECTRONICS COOLING MODULE

• US 20190320556A1
• Filed: 04/17/2018
• Published: 10/17/2019
• Est. Priority Date: 04/17/2018
• Status: Active Grant

• Current Assignee: GE Aviation Systems LLC (GE Aerospace)
• Original Assignee: GE Aviation Systems LLC (GE Aerospace)
• Inventors: Dariavach, Nader, Engelhardt, Michel, Yang, Liqiang
• Granted Patent: US 10,645,844 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20263 Heat dissipaters releasing heat from coolant
• CPC Class Codes: H05K 7/20272 Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
• CPC Class Codes: H05K 7/20636 within sub-racks for removing heat from electronic boards
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.

Claims

1. A liquid cooling module for cooling a silicon carbide electronic component, comprising:

a housing supporting the silicon carbide electronic component, the housing having a cavity containing a liquid metal within a liquid flow channel thermally coupled to the silicon carbide electronic component, with the liquid flow channel defining a closed cooling loop;

a cold plate supporting the housing and having a cooling channel containing a liquid coolant and thermally coupled to the liquid flow channel via the housing;

a pump configured to pump the liquid coolant through the cooling channel;

a channel impeller located in the cooling channel of the cold plate for circulating the liquid coolant through the cooling channel;

a housing impeller positioned in the cavity for circulating the liquid metal through the cooling loop; and

a shaft extending through the housing and cold plate and coupling the housing impeller to the channel impeller such that rotation of the channel impeller drives rotation of the housing impeller.

3. The liquid cooling module of claim 1 wherein a portion of the liquid flow channel runs proximate the cold plate.

7. The liquid cooling module of claim 1 wherein the liquid coolant comprises one of water, ethylene glycol, propylene glycol, fuel-based coolant, or oil-based coolant.

12. The liquid cooling module of claim 1 wherein the housing impeller and the channel impeller rotate simultaneously.

13. The liquid cooling module of claim 1 wherein the channel impeller is hydraulically powered by the liquid coolant within the cooling channel.

27. The liquid cooling module of claim 1 wherein the liquid metal comprises one of gallium, gallium alloy, or sodium-potassium alloy.

2. (canceled)

4-6. -6. (canceled)

8-11. -11. (canceled)

14. A method of cooling a heat generating silicon carbide electronic component, the method comprising:

driving rotation of a housing impeller to flow liquid metal coolant through a closed-loop liquid flow channel in a housing supporting the silicon carbide electronic component;

driving rotation of a channel impeller via the housing impeller to flow a second coolant through a cooling channel thermally coupled to the liquid flow channel and located in a cold plate supporting the housing;

transferring heat from the silicon carbide electronic component to the liquid metal coolant; and

transferring heat from the liquid metal coolant to the second coolant.

15. The method of claim 14 further comprising connecting the housing impeller to a channel impeller via a shaft.

28. The method of claim 15 wherein the transferring heat from the liquid metal coolant to the second coolant further comprises transferring heat via conduction from the housing impeller to the channel impeller via the shaft.

29. The method of claim 14 wherein the driving rotation of the housing impeller further comprises flowing the liquid metal coolant proximate the cold plate.

30. The method of claim 14 wherein the driving rotation of the channel impeller further comprises driving the second coolant through the cooling channel via a pump.

31. The method of claim 14 wherein the transferring heat from the liquid metal coolant to the second coolant further comprises transferring heat via induction from the housing to the cold plate.

32. The method of claim 14 wherein the second coolant comprises one of water, ethylene glycol, propylene glycol, fuel-based coolant, or oil-based coolant.

33. The method of claim 14 wherein the liquid metal comprises one of gallium, gallium alloy, or sodium-potassium alloy.

16-20. -20. (canceled)

21. An electronics chassis for an aircraft, comprising:

a chassis housing defining an interior;

an avionics system located within the interior and having at least one electronic component; and

a liquid cooling module, comprising;

a housing supporting the at least one electronic component, the housing having a cavity containing a liquid metal within a liquid flow channel thermally coupled to the at least one electronic component, with the liquid flow channel defining a closed cooling loop;

a cold plate supporting the housing and having a cooling channel containing a liquid coolant and thermally coupled to the liquid flow channel via the housing;

a pump configured to pump the liquid coolant through the cooling channel;

a channel impeller located in the cooling channel of the cold plate for circulating the liquid coolant through the cooling channel;

a housing impeller positioned in the cavity for circulating the liquid metal through the cooling loop; and

a shaft extending through the housing and cold plate and coupling the housing impeller to the channel impeller such that rotation of the channel impeller drives rotation of the housing impeller.

22. The electronics chassis of claim 21 wherein the at least one electronic component comprises a silicon carbide electronic component.

23. The electronics chassis of claim 21 wherein the liquid coolant comprises one of water, ethylene glycol, propylene glycol, fuel-based coolant, or oil-based coolant.

24. The electronics chassis of claim 21 further comprising at least one slot configured to mount to the at least one electronic component.

25. The electronics chassis of claim 21 further comprising a set of fins projecting from an exterior surface of the chassis housing and thermally coupled to the interior.

26. The electronics chassis of claim 21 wherein the liquid metal comprises one of gallium, gallium alloy, or sodium-potassium alloy.