Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions
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Accused Products
Abstract
An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
0 Citations
18 Claims
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1-9. -9. (canceled)
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10. A method for shielding electromagnetic interference in an electronic package, said method comprising:
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(a) providing; (i) a heat-generating electronic component; (ii) a heat dissipation member; and (iii) an interface member comprising a polymer matrix and a heterogeneous particulate filler dispersed in said polymer matrix at 30-50% by volume, said heterogeneous particulate filler including substantially spherical particles having an aspect ratio of between 0.8-1.2 and a median spherical particle diameter, and platelet particles having a length, a width, a thickness, and a median platelet particle diameter, wherein said platelet length and said platelet width are each greater than said platelet thickness, said platelet particles having an aspect ratio of at least 10, a volumetric loading ratio of said platelet particles to said substantially spherical particles being between 0.1;
1 and 0.2;
1, and a particle diameter ratio of said median platelet particle diameter to said median spherical diameter being between 1;
1 and 10;
1; and(b) arranging said interface member between said heat-generating electronic component and said heat dissipation member along a thermal dissipation pathway from said heat-generating electronic component to said heat dissipation member, wherein said interface member exhibits a thermal conductivity of at least 0.5 W/m·
K, a bulk hardness of between 10-70 Shore 00 at 20°
C., and an electromagnetic interference suppression of at least 10% along said thermal dissipation pathway. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification