SURFACE-TREATED MATERIAL AND COMPONENT PRODUCED BY USING THE SAME
First Claim
1. A surface-treated material comprising an electroconductive substrate and a surface treatment film formed of at least one or more layers of metal layers which are formed on the electroconductive substrate,wherein among the at least one or more layers of metal layers, a lowermost metal layer which is a metal layer directly formed on the electroconductive substrate comprises a plurality of metal-buried portions that are scattered in the electroconductive substrate, branch from a surface of the electroconductive substrate and widely extend toward an inside thereof;
- andwhen a region is defined as an observation region of the electroconductive substrate as a vertical cross section of the surface-treated material is viewed, in which at least one of the metal-buried portions exists in the electroconductive substrate, the region being demarcated by a first line segment that is drawn on the surface of the electroconductive substrate, a second line segment that is drawn so as to pass through a terminal position of the metal-buried portion, at which the metal-buried portion extends longest along a thickness direction of the electroconductive substrate, and be parallel to the first line segment, and third and fourth line segments that pass through respective positions of a cross-sectional width of the electroconductive substrate of 20 μ
m with the metal-buried portion having the terminal position as a center, and are orthogonal to each of the first line segment and the second line segment, an average value of an area ratio of the metal-buried portion in the observation region is in a range of 5% or more and 50% or less.
1 Assignment
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Accused Products
Abstract
A surface-treated material (10) according to the present invention comprises an electroconductive substrate (1) and a surface treatment film (2) formed of at least one or more layers of metal layers (3 and 4) which are formed on the electroconductive substrate (1), wherein among the at least one or more layers of metal layers (3 and 4), the lowermost metal layer (3) which is directly formed on the electroconductive substrate (1) comprises a plurality of metal-buried portions (3a) that are scattered in the electroconductive substrate (1), branch from a surface of the electroconductive substrate (1) and widely extend toward the inside thereof, and as a vertical cross section of the surface-treated material (10) is viewed, in which at least one of the metal-buried portions (3a) exists in the electroconductive substrate (1), an average value of an area ratio of the metal-buried portion (3a) occupying the predetermined observation region of the electroconductive substrate (1) is in a range of 5% or more and 50% or less.
4 Citations
18 Claims
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1. A surface-treated material comprising an electroconductive substrate and a surface treatment film formed of at least one or more layers of metal layers which are formed on the electroconductive substrate,
wherein among the at least one or more layers of metal layers, a lowermost metal layer which is a metal layer directly formed on the electroconductive substrate comprises a plurality of metal-buried portions that are scattered in the electroconductive substrate, branch from a surface of the electroconductive substrate and widely extend toward an inside thereof; - and
when a region is defined as an observation region of the electroconductive substrate as a vertical cross section of the surface-treated material is viewed, in which at least one of the metal-buried portions exists in the electroconductive substrate, the region being demarcated by a first line segment that is drawn on the surface of the electroconductive substrate, a second line segment that is drawn so as to pass through a terminal position of the metal-buried portion, at which the metal-buried portion extends longest along a thickness direction of the electroconductive substrate, and be parallel to the first line segment, and third and fourth line segments that pass through respective positions of a cross-sectional width of the electroconductive substrate of 20 μ
m with the metal-buried portion having the terminal position as a center, and are orthogonal to each of the first line segment and the second line segment, an average value of an area ratio of the metal-buried portion in the observation region is in a range of 5% or more and 50% or less. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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2. A surface-treated material comprising an electroconductive substrate and a surface treatment film formed of one or more layers of metal layers on the electroconductive substrate,
wherein among the metal layers forming the surface treatment film, a lowermost metal layer in contact with the electroconductive substrate comprises a plurality of metal-buried portions that branch from a surface of the electroconductive substrate and widely extend toward the inside thereof, and in a vertical cross section of the electroconductive substrate in which the metal-buried portion exists, an average value of an area ratio of the metal-buried portion occupying an observation region represented by (cross-sectional width parallel to surface of electroconductive substrate of 20 μ - m)×
(depth from surface of electroconductive substrate to terminal position of metal-buried portion) is in a range of 5% or more and 50% or less.
- m)×
Specification
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- Resources
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Current AssigneeFurukawa Electric Company Limited
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Original AssigneeFurukawa Electric Company Limited
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InventorsKOBAYASHI, Yoshiaki, YAMAUCHI, Miho
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Application NumberUS16/473,822Publication NumberTime in Patent OfficeDaysField of SearchUS Class CurrentCPC Class CodesC25D 3/12 of nickel or cobaltC25D 3/38 of copperC25D 5/10 Electroplating with more th...C25D 5/12 at least one layer being of...C25D 5/44 AluminiumC25D 5/50 by heat-treatmentC25D 5/617 Crystalline layersH01B 1/02 mainly consisting of metals...H01B 1/023 Alloys based on aluminiumH01R 13/03 characterised by the materi...H01R 43/16 for manufacturing contact m...
