MICRO ELECTRICAL MECHANICAL SYSTEM (MEMS) VALVE

• US 20190323627A1
• Filed: 07/03/2019
• Published: 10/24/2019
• Est. Priority Date: 01/12/2018
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: XIN, YONGCHUN, PIPER, DANIEL, FRY, JONATHAN, SIM, JANG
• Granted Patent: US 11,187,349 B2
• Time in Patent Office: Days
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/0084 Chemistry or biology, e.g. "lab-on-a-chip" technology
• CPC Class Codes: F16K 2099/0088 Implanted devices
• CPC Class Codes: F16K 99/0011 Gate valves or sliding valves
• CPC Class Codes: F16K 99/0013 Rotary valves
• CPC Class Codes: F16K 99/004 using radiation

Abstract

A micro electrical mechanical system (MEMS) valve is provided. The MEMS valve includes first and second bodies, a medium and a thermal element. The first body defines a first channel and a second channel intersecting the first channel. The second body defines a third channel and is movable within the first channel between first and second positions. When the second body is at the first positions, the second and third channels align and permit flow through the second and third channels. When the second body is at the second positions, the second and third channels misalign and inhibit flow through the second channel. The medium is charged into the first channel at opposite sides of the second body. The thermal element is proximate to the first channel and is operable to cause the medium to drive movements of the second body to the first or the second positions.

Claims

1. A micro electrical mechanical system (MEMS) valve, comprising:

a first body defining a first channel and a second channel intersecting the first channel;

a second body defining a third channel and being disposed to rotate within the first channel between;

first rotational positions with the second and third channels rotationally aligned to permit flow through the second and third channels, and

second rotational positions with the second and third channels rotationally misaligned to inhibit flow through the second channel;

a medium charged into the first channel at opposite sides of the second body; and

a thermal element proximate to the first channel and operable to adjust relative temperatures and pressures of the medium at the opposite sides of the second body to drive a rotation of the second body to the first or the second rotational positions.

2. The MEMS valve according to claim 1, wherein the thermal element is remotely activated.

3. The MEMS valve according to claim 1, wherein the first body further defines an additional channel fluidly communicative with the second channel.

4. The MEMS valve according to claim 1, wherein the second body is self-sealing within the first channel.

5. The MEMS valve according to claim 1, wherein an exterior surface of the second body is scalloped.

6. The MEMS valve according to claim 1, wherein:

at least one of the first rotational positions permits a unique level of flow through the rotationally aligned second and third channels, and

at least one of the second rotational positions inhibits a unique level of flow through the second channel.

7. The MEMS valve according to claim 1, further comprising stoppers disposed within the first channel to interfere with a sliding of the second body.

8. The MEMS valve according to claim 1, further comprising hydrophobic film lining at least intersecting portions of the first and second channels.

9. A method of fabricating a micro electrical mechanical system (MEMS) valve, the method comprising:

forming a first photoresist body to define a first channel and a second channel intersecting the first channel;

disposing a thermal element, which is configured to be remotely activated, proximate to the first channel;

capping a second body defining a third channel with nitride;

disposing oxide and the capped second body in the first channel such that the oxide surrounds the capped second body and such that the third channel is parallel with and movably disposed for alignment or misalignment relative to the second channel; and

etching the oxide from around the capped second body.

10. The method according to claim 9, further comprising:

charging a medium into the first channel at opposite sides of the capped second body; and

remotely operating the thermal element to adjust relative temperatures and pressures of the medium to thereby drive movements of the capped second body in the first channel whereby the third channel is aligned or misaligned with the second channel.

11. The method according to claim 9, wherein the disposing of the oxide and the capped second body comprises:

forming a lower portion of the first photoresist body to define inlet and lower portions of the second and first channels, respectively;

depositing the oxide into the inlet and lower portions of the second and first channels, respectively;

patterning a recess into the oxide;

depositing the nitride on the oxide in the recess;

forming the second body on the nitride in the recess;

depositing the nitride on exposed surfaces of the second body; and

forming an upper portion of the first photoresist body to define outlet and upper portions of the second and first channels, respectively.

12. The method according to claim 9, further comprising lining at least intersecting portions of the first and second channels with hydrophobic film.