OPTICAL TRANSPOSER ASSEMBLY

• US 20190324201A1
• Filed: 04/19/2018
• Published: 10/24/2019
• Est. Priority Date: 04/19/2018
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: CELO, Dritan, GOODWILL, Dominic John, BERNIER, Eric
• Granted Patent: US 10,509,165 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 2006/12061 Silicon
• CPC Class Codes: G02B 2006/12102 Lens
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 2006/12111 Fibre
• CPC Class Codes: G02B 2006/12121 Laser
• CPC Class Codes: G02B 2006/12123 Diode
• CPC Class Codes: G02B 2006/12147 Coupler
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/122 Basic optical elements, e.g. light-guiding paths
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device
• CPC Class Codes: H01S 5/50 Amplifier structures not provided for in groups H01S5/02 - H01S5/30

Abstract

An assembly with optical gain assisted optical transposer is provided. The optical transposer which optically couples a fibre array unit and a photonic integrated circuit. The optical transposer includes one or more optical gain elements which are configured to provide optical compensation, for example optical gain to mitigate optical losses associated with multistage photonic integrated devices. According to some embodiments, the optical gain element is a semiconductor optical amplifier (SOA). According to some embodiments the photonic integrated circuit is a SiPh PIC.

Claims

1. An assembly comprising:

a fibre array unit optically coupled to a plurality of optical fibres;

an optical transposer including waveguides, the waveguides optically coupling the fibre array unit and a photonic integrated circuit, the photonic integrated circuit disposed independently of the optical transposer via an optical interface and

an optical gain element disposed in a well within the optical transposer, the optical gain element being optically coupled to at least one of the waveguides, the optical gain element providing optical gain to offset optical coupling loss into the at least one waveguide.

2. The assembly according to claim 1, wherein the optical transposer has a front-end and a back-end and wherein at the front-end the waveguides have a first spacing and the back-end the waveguides have a second spacing, wherein the first spacing is different from the second spacing.

3. The assembly according to claim 1, wherein the optical transposer has a front-end and a back-end and wherein at the front-end the waveguides have a first spacing and the back-end the waveguides have a second spacing, wherein the first spacing equals the second spacing.

4. The assembly according to claim 1, wherein the optical transposer is optically coupled to the fibre array unit or the photonic integrated circuit at least in part using edge coupling, vertical coupling, surface grating coupling, evanescent coupling or butt coupling.

5. The assembly according to claim 1, wherein the optical transposer is optically coupled to the fibre array unit or the photonic integrated circuit at least in part using lenses or micro-electromechanical systems mirrors.

6. The assembly according to claim 1, wherein the optical transposer is fabricated from glass or silica-on-silicon or silicon nitride or InP or polymer.

7. The assembly according to claim 1, wherein the optical transposer is a fibre space concentrator.

9. The assembly according to claim 1, wherein the optical gain element is optically coupled to an edge of the optical transposer.

10. The assembly according to claim 9, wherein an alignment waveguide and alignment loop are provided to alignment of optical coupling between the optical gain element and the optical transposer.

11. The assembly according to claim 1, wherein the optical gain element is thermally coupled to a thermal dissipation device.

12. The assembly according to claim 11, wherein the thermal dissipation device is one or more of a heat sink, thermo-electric cooler and heat pipe.

13. The assembly according to claim 1, wherein the optical gain element is one or more of a semiconductor optical amplifier, a laser, a laser diode and a vertical cavity surface emitting laser.

14. The assembly according to claim 1, wherein an input optical connection and an output optical connection of the optical gain element to the at least one of the waveguides of the optical transposer are located on a same side of the optical gain element.

15. The assembly according to claim 1, wherein multiple optical gain elements are optically coupled to the at least one waveguide of the optical transposer.

16. The assembly according to claim 1, wherein the optical gain element is electrically connected to an electronic drive through vias formed in the optical transposer.

17. The assembly according to claim 1, wherein the photonic integrated circuit is a SiPh photonic integrated circuit.

18. The assembly according to claim 1, wherein optical gain is applied to an optical signal travelling from the fibre array unit to the photonic integrated circuit or vice versa.

19. The assembly according to claim 1, wherein optical gain is only applied to an optical signal travelling from the fibre array unit to the photonic integrated circuit.

8. (canceled)