ELECTRONIC COMPONENT

• US 20190326059A1
• Filed: 11/30/2018
• Published: 10/24/2019
• Est. Priority Date: 04/20/2018
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: PARK, Heung Kil, PARK, Se Hun, JI, Gu Won, AHN, Young Ghyu
• Granted Patent: US 10,777,356 B2
• Time in Patent Office: Days
• CPC Class Codes: H01G 2/065 for surface mounting, e.g. chip capacitors
• CPC Class Codes: H01G 4/008 Selection of materials
• CPC Class Codes: H01G 4/1227 based on alkaline earth titanates
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/2325 characterised by the material of the terminals
• CPC Class Codes: H01G 4/248 the terminals embracing or surrounding the capacitive element, e.g. caps H01G4/252 takes precedence
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: Y02E 60/10 Energy storage using batteries

Abstract

An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.

Claims

1. An electronic component comprising:

a capacitor body;

first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and

first and second connection terminals including an insulator, and electrically connected to the first and second external electrodes, respectively, through land patterns disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.

2. The electronic component of claim 1, wherein the first connection terminal includes a first land pattern disposed on a surface of the first connection terminal facing the first external electrode, a second land pattern disposed on a surface thereof opposing the first land pattern, and a first conductive pattern disposed on at least a portion of a surface thereof connecting the first and second land patterns to each other and electrically connecting the first and second land patterns to each other, and

the second connection terminal includes a third land pattern disposed on a surface of the second connection terminal facing the second external electrode, a fourth land pattern disposed on a surface thereof opposing the third land pattern, and a second conductive pattern disposed on at least a portion of a surface thereof connecting the third and fourth land patterns to each other and electrically connecting the third and fourth land patterns to each other.

3. The electronic component of claim 1, wherein at least one cut portion is formed in surfaces of the first and second connection terminals opposing each other in the length direction of the capacitor body, respectively.

4. The electronic component of claim 3, further comprising an additional cut portion formed in a surface of the first and second connection terminals in the width direction of the capacitor body.

5. The electronic component of claim 3, wherein a solder accommodating portion is provided on at least one selected from the group of the first and second external electrodes.

6. The electronic component of claim 3, wherein the cut portion includes a first cut portion disposed in a surface of the first connection terminal, and a second cut portion disposed in a surface of the first connection terminal,

the first connection terminal includes a first land pattern disposed on a surface of the first connection terminal facing the first external electrode, a second land pattern disposed on a surface thereof opposing the first land pattern, the first cut portion disposed on a portion of the surface thereof connecting the first and second land patterns to each other, and a first conductive pattern disposed on the first cut portion and electrically connecting the first and second land patterns to each other, and

the second connection terminal includes a third land pattern disposed on a surface of the second connection terminal facing the second external electrode, a fourth land pattern disposed on a surface thereof opposing the third land pattern, the second cut portion disposed on a portion of the surface thereof connecting the third and fourth land patterns to each other, and a second conductive pattern disposed on the second cut portion and electrically connecting the third and fourth land patterns to each other.

7. The electronic component of claim 6, wherein the first conductive pattern covers an entire surface of the first connection terminal connecting the first and second land patterns to each other or a portion of the surface including the first cut portion, and

the second conductive pattern covers an entire surface of the second connection terminal connecting the third and fourth land patterns to each other or a portion of the surface including the second cut portion.

8. The electronic component of claim 1, further comprising plating layers disposed on surfaces of the first and second external electrodes.

9. The electronic component of claim 1, wherein the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and has first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, and

one ends of the first and second internal electrodes are exposed to the third and fourth surfaces of the capacitor body, respectively.

10. The electronic component of claim 9, wherein the first and second external electrodes respectively include:

first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and

first and second band portions extended from the first and second connection portions to portions of the first surface of the capacitor body and connected to the first and second connection terminals, respectively.

11. The electronic component of claim 3, wherein the solder accommodating portion is disposed toward the mounting surface of the capacitor body by the cut portion.

12. The electronic component of claim 3, wherein a plurality of cut portions are formed in each of the surfaces of the first and second connection terminals opposing each other in the length direction of the capacitor body, respectively.

13. The electronic component of claim 1, wherein the bridge portions include at least one selected from the group of FR-4, F-PCB and a ceramic material.