SUBSTRATE SUPPORT WITH EDGE SEAL

• US 20190326152A1
• Filed: 04/18/2019
• Published: 10/24/2019
• Est. Priority Date: 04/19/2018
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: KE, CHANG, CHIA, BONNIE, SUH, SONG-MOON, TSAI, CHENG-HSIUNG, GUO, YUANHONG, ZHOU, LEI, LANGTRY, DAVID
• Granted Patent: US 11,508,610 B2
• Time in Patent Office: Days
• CPC Class Codes: C23C 16/0227 by cleaning or etching
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/4557 Heated nozzles
• CPC Class Codes: C23C 16/4585 Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
• CPC Class Codes: H01L 21/0209 Cleaning of wafer backside
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/68721 characterised by edge clamping, e.g. clamping ring
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile

Abstract

Methods and apparatus for supporting a substrate are provided herein. In some embodiments, a substrate support to support a substrate having a given diameter includes: a base ring having an inner diameter less than the given diameter, the base ring having a support surface configured to contact a first surface of the substrate and to form a seal between the support surface and the first surface of the substrate, when disposed atop the base ring; and a clamp ring having an inner diameter less than the given diameter, wherein the clamp ring includes a contact surface proximate the inner diameter configured to contact an upper surface of the substrate, when present, and wherein the clamp ring and the base ring are further configured to provide a bias force toward each other to clamp the substrate in the substrate support.

Claims

1. A substrate support to support a substrate having a given diameter, comprising:

a base ring having an inner diameter less than the given diameter, the base ring having a support surface configured to contact a first surface of the substrate and to form a seal between the support surface and the first surface of the substrate, when disposed atop the base ring; and

a clamp ring having an inner diameter less than the given diameter, wherein the clamp ring includes a contact surface proximate the inner diameter configured to contact an upper surface of the substrate, when present, and wherein the clamp ring and the base ring are further configured to provide a bias force toward each other to clamp the substrate in the substrate support.

2. The substrate support of claim 1, further comprising:

an elastomeric seal disposed in or on the support surface of the base ring along a diameter that is less than the given diameter.

3. The substrate support of claim 1, wherein the contact surface of the clamp ring is disposed at an inward angle such that the contact surface contacts the substrate along an outer edge of the substrate when the substrate is present.

4. The substrate support of claim 1, further comprising:

a plurality of vents formed through the clamp ring, each vent running from a point along an inner diametral surface of the clamp ring having a diameter less than the given diameter, to an upper surface of the clamp ring.

5. The substrate support of claim 1, further comprising:

a window transparent to radiant energy disposed atop the clamp ring and covering a central opening of the clamp ring.

6. The substrate support of claim 1, wherein the base ring is made of polytetrafluoroethylene.

7. The substrate support of claim 1, further comprising one or more magnets disposed in each of the base ring and the clamp ring to provide an attractive force between the base ring and the clamp ring.

8. The substrate support of claim 7, wherein the one or more magnets disposed in each of the base ring and the clamp ring are disposed in corresponding opposing locations in the base ring and the clamp ring.

9. The substrate support of claim 1, wherein each of the base ring and the clamp ring have an outer diameter greater than the given diameter.

10. A substrate support to support a substrate having a given diameter, comprising:

a base ring having an inner diameter less than the given diameter, the base ring having a support surface configured to contact a first surface of the substrate and to form a seal between the support surface and the first surface of the substrate, when disposed atop the base ring; and

a clamp ring disposed above the base ring and having an angled contact surface configured to contact an upper surface of the substrate, wherein each of the clamp ring and the base ring includes one or more magnets configured to provide an attractive force between the base ring and the clamp ring to clamp the substrate in the substrate support.

11. The substrate support of claim 10, further comprising an elastomeric seal disposed in or on the support surface of the base ring along a diameter that is less than the given diameter.

12. The substrate support of claim 11, wherein the elastomeric seal is disposed radially inward of the one or more magnets of the base ring.

13. A process chamber for cleaning a backside of a substrate, comprising:

a substrate support that separates an interior volume of the process chamber into an upper volume disposed above the substrate support and a lower volume disposed below the substrate support, wherein the substrate support includes a base ring having an inner diameter less than a given diameter of the substrate and a support surface configured to form a seal between the support surface and a first surface of the substrate when disposed atop the base ring, and a clamp ring having an inner diameter less than the given diameter, wherein the clamp ring includes a contact surface configured to contact an upper surface of the substrate, and wherein the clamp ring and the base ring are further configured to provide a bias force toward each other to clamp the substrate in the substrate support; and

a cryogenic cleaning apparatus disposed in the lower volume and configured to provide a stream of cleaning materials toward the backside of the substrate to be cleaned, wherein the cryogenic cleaning apparatus includes a movable arm and a nozzle.

14. The process chamber of claim 13, wherein the movable arm is configured to move the nozzle at least between a center and an outer peripheral edge of the substrate.

15. The process chamber of claim 13, wherein the nozzle is disposed at a distance of about 0.5 to about 2.0 inches away from the first surface of the substrate.

16. The process chamber of claim 13, further comprising a cleaning material source coupled to the nozzle.

17. The process chamber of claim 16, wherein the cleaning material source includes liquid carbon dioxide (CO₂), nitrogen (N₂), argon (Ar), or neon (Ne).

18. The process chamber of claim 13, further comprising an actuator coupled to the substrate support to facilitate at least one of vertical or rotational motion of the substrate support.

19. The process chamber of claim 18, wherein the actuator provides an upward force against the base ring to bias the base ring toward the clamp ring.

20. The process chamber of claim 18, wherein the base ring is coupled to the actuator to facilitate moving the base ring from a raised processing position to a lower transfer position where the base ring is aligned with or lower than a door formed in the process chamber.