×

Method for Stabilizing a Semiconductor Arrangement

  • US 20190326155A1
  • Filed: 04/18/2019
  • Published: 10/24/2019
  • Est. Priority Date: 04/19/2018
  • Status: Active Grant
First Claim
Patent Images

1. A method, comprising:

  • producing a semiconductor arrangement having a semiconductor layer, a first insulation layer arranged on the semiconductor layer and facing a first surface of the semiconductor arrangement, and an insulating via extending in a vertical direction through the semiconductor layer as far as the first insulation layer, the insulating via surrounding a region of the semiconductor layer in a ring-shaped fashion; and

    permanently securing a first carrier to the first surface of the semiconductor arrangement.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×