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SEMICONDUCTOR DEVICE WITH ENCAPSULATING RESIN

  • US 20190326189A1
  • Filed: 04/10/2019
  • Published: 10/24/2019
  • Est. Priority Date: 04/18/2018
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • an interconnect substrate having a plurality of pads formed on a first surface thereof;

    a semiconductor chip having a plurality of electrodes formed on a circuit surface thereof, the semiconductor chip being mounted on the interconnect substrate such that the circuit surface faces the first surface;

    a plurality of bonding members that are made of a same material and that electrically couple the pads and the electrodes; and

    a resin disposed on the first surface to encapsulate the semiconductor chip and to fill a gap between the circuit surface and the first surface,wherein the semiconductor chip is mounted on the interconnect substrate such that the gap between the circuit surface and the first surface progressively increases from a first side to a second side.

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