SEMICONDUCTOR DEVICE WITH ENCAPSULATING RESIN

• US 20190326189A1
• Filed: 04/10/2019
• Published: 10/24/2019
• Est. Priority Date: 04/18/2018
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Sato, Seiji
• Granted Patent: US 10,784,177 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05555 being circular or elliptic
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/0801 Structure
• CPC Class Codes: H01L 2224/08135 the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
• CPC Class Codes: H01L 2224/08151 the bonding area connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13116 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81007 involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the bump connector during or after the bonding process
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/014 : Solder alloys

Abstract

A semiconductor device includes an interconnect substrate having a plurality of pads formed on a first surface thereof, a semiconductor chip having a plurality of electrodes formed on a circuit surface thereof, the semiconductor chip being mounted on the interconnect substrate such that the circuit surface faces the first surface, a plurality of bonding members that are made of a same material and that electrically couple the pads and the electrodes, and a resin disposed on the first surface to encapsulate the semiconductor chip and to fill a gap between the circuit surface and the first surface, wherein the semiconductor chip is mounted on the interconnect substrate such that the gap between the circuit surface and the first surface progressively increases from a first side to a second side.

Claims

1. A semiconductor device, comprising:

an interconnect substrate having a plurality of pads formed on a first surface thereof;

a semiconductor chip having a plurality of electrodes formed on a circuit surface thereof, the semiconductor chip being mounted on the interconnect substrate such that the circuit surface faces the first surface;

a plurality of bonding members that are made of a same material and that electrically couple the pads and the electrodes; and

a resin disposed on the first surface to encapsulate the semiconductor chip and to fill a gap between the circuit surface and the first surface,

wherein the semiconductor chip is mounted on the interconnect substrate such that the gap between the circuit surface and the first surface progressively increases from a first side to a second side.

2. The semiconductor device as claimed in claim 1, wherein the pads include pads having contact surfaces that are bonded to the bonding members, and wherein the areas of the contact surfaces of the pads are smaller with respect to a pad disposed on the second side than with respect to a pad disposed on the first side.

3. The semiconductor device as claimed in claim 2, wherein the pads include three or more types of pads that have respective, different contact surface areas, and the three or more types of pads are arranged such that the contact surface areas progressively decrease from the first side to the second side.

4. The semiconductor device as claimed in claim 1, further comprising one or more protrusions situated on the second side, between the circuit surface and the first surface.

5. The semiconductor device as claimed in claim 4, wherein a plan shape of the semiconductor chip is rectangular,

wherein in a plan view, the circuit surface has a first edge situated on a same side as the first side, a second edge parallel to the first edge and situated on a same side as the second side, a third edge connecting one end of the first edge and one end of the second edge, and a fourth edge connecting another end of the first edge and another end of the second edge, and

wherein the one or more protrusions include two protrusions that are disposed at respective corners, the corners being a corner formed by the second edge and the third edge and a corner formed by the second edge and the fourth edge.