SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
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Accused Products
Abstract
A reliability cover that is disposed over at least one of an integrated circuit package and a Si die of the integrated circuit package is disclosed. The integrated circuit package is mountable to a printed circuit board via a plurality of solder balls. The reliability cover is configured to reduce a difference in a coefficient of thermal expansion between the integrated circuit package and the printed circuit board, and between the Si die and a substrate of the integrated circuit package by a threshold value.
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40 Claims
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1-20. -20. (canceled)
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21. A method comprising:
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identifying a failure profile of solder joints formed between a first component and a level of interconnects and between the level of interconnects and a second component; and disposing a reliability cover over one or more surfaces of at least one of the first component and the second component based upon the failure profile. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification