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SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

  • US 20190326202A1
  • Filed: 07/02/2019
  • Published: 10/24/2019
  • Est. Priority Date: 03/15/2013
  • Status: Abandoned Application
First Claim
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1. A leadframe comprising:

  • a conductive substrate electrically coupled to a first lead, wherein the conductive substrate comprises a first elevated region on a first side of the conductive substrate and a second elevated region on the first side of the conductive substrate, wherein the first elevated region comprises a first planar surface on the first side of the conductive substrate, and wherein the second elevated region comprises a second planar surface on the first side of the conductive substrate;

    wherein the first planar surface of the first elevated region and the second planar surface of the second elevated region are configured to attach to a contact pad of a semiconductor die;

    wherein the first planar surface comprises a curved edge;

    wherein the second planar surface has a polygonal shape; and

    wherein the curved edge of the first planar surface is configured to laterally align with a curved edge of the contact pad of the semiconductor die.

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