VOLTAGE NOISE REDUCTION OF POWER DELIVERY NETWORKS FOR INTEGRATED CIRCUITS

• US 20190326212A1
• Filed: 11/29/2017
• Published: 10/24/2019
• Est. Priority Date: 12/29/2016
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: HUANG, Jimmy Huat Since, CAI, Xingjian, ONG, Paik Wen, CHEN, Herh Nan, JI, Yun
• Granted Patent: US 10,971,444 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/5222 Capacitive arrangements or effects of, or between wiring layers other capacitive arrangements H01L23/642
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/5286 Arrangements of power or ground buses
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 27/06 including a plurality of individual components in a non-repetitive configuration
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H03H 7/01 Frequency selective two-port networks
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB

Abstract

An electronic apparatus and an electronic system may include a first power delivery network (PDN) and a second PDN. The first PDN may include a first inductor as a segment of a power rail of the first PDN, while the second PDN may include a second inductor as a segment of a power rail of the second PDN. The first inductor and the second inductor may form a magnetically coupled inductor. The magnetically coupled inductor may provide migrated impedance Z_T to the first PDN induced by the magnetically coupled inductor. The migrated impedance Z_T to the first PDN may help the first PDN to reduce its voltage noise. Other embodiments may be described and/or claimed.

Claims

1-25. -25. (canceled)

26. An electronic apparatus, comprising:

a first inductor, wherein the first inductor is a segment of a power rail of a first power delivery network (PDN) that has a first capacitance with a first voltage noise; and

a second inductor, wherein the second inductor is a segment of a power rail of a second PDN, the second PDN has a second capacitance with a second voltage noise, wherein the first inductor and the second inductor form a magnetically coupled inductor, and wherein

the first PDN includes an impedance induced by the magnetically coupled inductor to reduce the first voltage noise to a third voltage noise.

27. The electronic apparatus of claim 26, wherein the first voltage noise is larger than a first power integrity performance target, the second voltage noise is smaller than a second power integrity performance target, and the third voltage noise is smaller than the first power integrity performance target.

28. The electronic apparatus of claim 26, wherein the first inductor and the second inductor are included in a substrate.

29. The electronic apparatus of claim 28, wherein the substrate is a package substrate coupled with a printed circuit board (PCB), the first PDN includes a first segment of the first PDN within the PCB, a second segment of the first PDN within the substrate including the first inductor, and a third segment of the first PDN within a first integrated circuit (IC) coupled with the substrate, and wherein the second PDN includes a first segment of the second PDN within the PCB, a second segment of the second PDN within the substrate including the second inductor, and a third segment of the second PDN within a second IC coupled with the substrate.

30. The electronic apparatus of claim 29, wherein the first IC or the second IC is a central processing unit (CPU), a graphic processing unit (GPU), a memory chip, a phase-locked loop (PLL) chip, or an input/output (I/O) interface chip.

31. The electronic apparatus of claim 29, wherein the second capacitance includes an intrinsic capacitance of the second IC, a capacitance of an on-die capacitor within the second IC, a capacitance of a capacitor placed over a surface of the substrate, a capacitance of an in-package capacitor within the substrate, or a capacitance of an on-board capacitor within the PCB.

32. The electronic apparatus of claim 29, wherein the first capacitance includes an intrinsic capacitance of the first IC without an on-die capacitor within the first IC.

33. The electronic apparatus of claim 29, wherein the substrate is the package substrate for a system-on-chip (SoC), the first IC and the PCB are placed at two opposite sides of the substrate, and wherein the substrate includes a plurality of layers, and the first inductor is included within a portion of the substrate closer to the PCB instead of the first IC.

34. The electronic apparatus of claim 26, wherein the second PDN includes a high frequency rail and a low frequency rail, and wherein the second inductor is a segment of the high frequency rail of the second PDN.

35. The electronic apparatus of claim 26, wherein there is no direct current (DC) path between the first PDN and the second PDN.

36. The electronic apparatus of claim 26, wherein a coupling factor between the first inductor and the second inductor is greater than about 70%.

37. The electronic apparatus of claim 26, wherein the first inductor includes a rectangular plate having a width relative to a surface of the substrate in a range of about 1.0 mm to 1.5 mm, a length relative to the surface of the substrate in a range of about 1.0 mm to 1.5 mm, and a height relative to the surface of the substrate in a range of about 0.1 mm to 0.5 mm.

38. The electronic apparatus of claim 26, wherein the first inductor is of a triangular shape, a square shape, a rectangular shape, or a spiral shape.

39. The electronic apparatus of claim 26, wherein the first inductor includes copper or aluminum.

40. An electronic apparatus, comprising:

a substrate;

a first inductor placed within the substrate, wherein the first inductor is a segment of a power rail of a first power delivery network (PDN), and the first PDN has a first capacitance with a first voltage noise; and

a second inductor placed within the substrate, wherein the second inductor is a segment of a power rail of a second PDN, the second PDN has a second capacitance with a second voltage noise, wherein the first inductor and the second inductor form a magnetically coupled inductor, and wherein

the first PDN includes an impedance induced by the magnetically coupled inductor to reduce the first voltage noise to a third voltage noise.

41. The electronic apparatus of claim 40, wherein the substrate is a package substrate coupled with a printed circuit board (PCB), the first PDN includes a first segment of the first PDN within the PCB, a second segment of the first PDN within the substrate including the first inductor, and a third segment of the first PDN within a first integrated circuit (IC) coupled with the substrate, and wherein the second PDN includes a first segment of the second PDN within the PCB, a second segment of the second PDN within the substrate including the second inductor, and a third segment of the second PDN within a second IC coupled with the substrate.

42. The electronic apparatus of claim 41, wherein the second capacitance includes an intrinsic capacitance of the second IC, a capacitance of an on-die capacitor within the second IC, a capacitance of a capacitor placed over a surface of the substrate, a capacitance of an in-package capacitor within the substrate, or a capacitance of an on-board capacitor within the PCB.

43. The electronic apparatus of claim 41, wherein the first capacitance includes an intrinsic capacitance of the first IC without an on-die capacitor within the first IC.

44. The electronic apparatus of claim 40, wherein a coupling factor between the first inductor and the second inductor is greater than about 70%.

45. The electronic apparatus of claim 40, wherein the first inductor includes a rectangular plate having a width relative to a surface of the substrate in a range of about 1.0 mm to 1.5 mm, a length relative to the surface of the substrate in a range of about 1.0 mm to 1.5 mm, and a height relative to the surface of the substrate in a range of about 0.1 mm to 0.5 mm.

46. A computing device, comprising:

a printed circuit board (PCB);

a package substrate coupled with the PCB, wherein the package substrate includes a first inductor and a second inductor, and wherein the first inductor is a segment of a power rail of a first power delivery network (PDN), the first PDN has a first capacitance, and the first PDN with the first capacitance has a first voltage noise larger than a first power integrity performance target, and wherein the second inductor is a segment of a power rail of a second PDN, the second PDN has a second capacitance, and the second PDN with the second capacitance has a second voltage noise smaller than a second power integrity performance target, and wherein the first inductor and the second inductor form a magnetically coupled inductor, and the first PDN includes an impedance induced by the magnetically coupled inductor to reduce the first voltage noise to a third voltage noise.

47. The computing device of claim 46, wherein the first PDN includes a first segment of the first PDN within the PCB, a second segment of the first PDN within the package substrate including the first inductor, and a third segment of the first PDN within a first integrated circuit (IC) coupled with the package substrate, and wherein the second PDN includes a first segment of the second PDN within the PCB, a second segment of the second PDN within the package substrate including the second inductor, and a third segment of the second PDN within a second IC coupled with the package substrate.

48. The computing device of claim 47, wherein the second capacitance includes an intrinsic capacitance of the second IC, a capacitance of an on-die capacitor within the second IC, a capacitance of a capacitor placed over a surface of the substrate, a capacitance of an in-package capacitor within the substrate, or a capacitance of an on-board capacitor within the PCB.

49. The computing device of claim 47, wherein the first capacitance includes only an intrinsic capacitance of the first IC without an on-die capacitor within the first IC.

50. The computing device of claim 47, wherein the first IC is different from the second IC.