RECEIVER AND TRANSMITTER CHIPS PACKAGING STRUCTURE AND AUTOMOTIVE RADAR DETECTOR DEVICE USING SAME
First Claim
1. A receiver and transmitter chips packaging structure, comprising:
- a redistribution layer including a plurality of conductive lines, a dielectric layer and a plurality of conductive elements;
the conductive lines being embedded in the dielectric layer;
the dielectric layer having a first side and an opposite second side; and
the conductive elements being arranged on the second side of the dielectric layer and being respectively electrically connected to an end of a corresponding one of the conductive lines;
a chip set including a receiver chip, a transmitter chip and a radio-frequency (RF) processing chip;
the receiver chip, the transmitter chip and the RF processing chip being arranged on the first side of the dielectric layer and being respectively electrically connected to another end of a corresponding one of the conductive lines; and
the RF processing chip being electrically connected to the receiver chip and the transmitter chip via the conductive lines; and
a molded encapsulation layer being formed on the first side of the dielectric layer to enclose the receiver chip, the transmitter chip and the RF processing chip therein.
1 Assignment
0 Petitions
Accused Products
Abstract
A receiver and transmitter chips packaging structure and an automotive radar detector device using same are disclosed. The receiver/transmitter chips packaging structure includes a redistribution layer, a chip set and a molded encapsulation layer. The chip set includes a receiver chip, a transmitter chip and a radio-frequency (RF) processing chip arranged on one side of redistribution layer. The molded encapsulation layer covers the side of the redistribution layer having the receiver, transmitter and RF processing chips arranged thereon and accordingly, enclosed the chip set therein. And, the RF processing chip is electrically connected to the receiver chip and the transmitter chip via a plurality of conductive lines embedded in the redistribution layer.
19 Citations
20 Claims
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1. A receiver and transmitter chips packaging structure, comprising:
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a redistribution layer including a plurality of conductive lines, a dielectric layer and a plurality of conductive elements;
the conductive lines being embedded in the dielectric layer;
the dielectric layer having a first side and an opposite second side; and
the conductive elements being arranged on the second side of the dielectric layer and being respectively electrically connected to an end of a corresponding one of the conductive lines;a chip set including a receiver chip, a transmitter chip and a radio-frequency (RF) processing chip;
the receiver chip, the transmitter chip and the RF processing chip being arranged on the first side of the dielectric layer and being respectively electrically connected to another end of a corresponding one of the conductive lines; and
the RF processing chip being electrically connected to the receiver chip and the transmitter chip via the conductive lines; anda molded encapsulation layer being formed on the first side of the dielectric layer to enclose the receiver chip, the transmitter chip and the RF processing chip therein. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An automotive radar detector device, comprising:
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a receiver and transmitter chips packaging structure including; a redistribution layer including a plurality of conductive lines, a dielectric layer and a plurality of conductive elements;
the conductive lines being embedded in the dielectric layer;
the dielectric layer having a first side and an opposite second side; and
the conductive elements being arranged on the second side of the dielectric layer and being respectively electrically connected to an end of a corresponding one of the conductive lines;a chip set including a receiver chip, a transmitter chip and a radio-frequency (RF) processing chip;
the receiver chip, the transmitter chip and the RF processing chip being arranged on the first side of the dielectric layer and being respectively electrically connected to another end of a corresponding one of the conductive lines; and
the RF processing chip being electrically connected to the receiver chip and the transmitter chip via the conductive lines; anda molded encapsulation layer being formed on the first side of the dielectric layer and enclosing the receiver chip, the transmitter chip and the RF processing chip therein; a substrate being selectively arranged on one side of the redistribution layer or the molded encapsulation layer, and having at least one first antenna, at least one second antenna, a plurality of conductive wirings and a plurality of contacts provided thereon to electrically connect to the conductive elements on the redistribution layer;
the conductive wirings being embedded in the substrate to electrically connect to the contacts that are formed on one side of the substrate; and
the first and the second antenna being provided on one side of the substrate to electrically connect to the receiver chip and the transmitter chip via the conductive wirings and the contacts; anda control chip being arranged on one side of the substrate to electrically connect to the receiver chip and the RF processing chip via the conductive wirings and the contacts. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification