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RECEIVER AND TRANSMITTER CHIPS PACKAGING STRUCTURE AND AUTOMOTIVE RADAR DETECTOR DEVICE USING SAME

  • US 20190326232A1
  • Filed: 04/23/2018
  • Published: 10/24/2019
  • Est. Priority Date: 04/23/2018
  • Status: Abandoned Application
First Claim
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1. A receiver and transmitter chips packaging structure, comprising:

  • a redistribution layer including a plurality of conductive lines, a dielectric layer and a plurality of conductive elements;

    the conductive lines being embedded in the dielectric layer;

    the dielectric layer having a first side and an opposite second side; and

    the conductive elements being arranged on the second side of the dielectric layer and being respectively electrically connected to an end of a corresponding one of the conductive lines;

    a chip set including a receiver chip, a transmitter chip and a radio-frequency (RF) processing chip;

    the receiver chip, the transmitter chip and the RF processing chip being arranged on the first side of the dielectric layer and being respectively electrically connected to another end of a corresponding one of the conductive lines; and

    the RF processing chip being electrically connected to the receiver chip and the transmitter chip via the conductive lines; and

    a molded encapsulation layer being formed on the first side of the dielectric layer to enclose the receiver chip, the transmitter chip and the RF processing chip therein.

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