ELECTRONIC DEVICE

• US 20190326329A1
• Filed: 03/21/2019
• Published: 10/24/2019
• Est. Priority Date: 04/19/2018
• Status: Abandoned Application

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: FAN, Chun-Chin, LIN, Ming-Chang, CHEN, Yun-Sheng
• Application Number:
  US16/360,521
• Publication Number:
  US 20190326329A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An electronic device is provided. The electronic device includes a substrate, a plurality of thin-film transistors disposed on the substrate, and a plurality of light-emitting units. One of the light-emitting units has an encapsulating glue and at least one light-emitting chip. The encapsulating glue is disposed on the light-emitting chip, and the light-emitting unit is electrically connected to at least one of the thin-film transistors.

Claims

1. An electronic device, comprising:

a substrate;

a plurality of thin-film transistors disposed on the substrate, and

a plurality of light-emitting units, wherein one of the plurality of light-emitting units has an encapsulating glue and at least one light-emitting chip, the encapsulating glue is disposed on the light-emitting chip, and the light-emitting unit is electrically connected to at least one of the plurality of thin-film transistors.

2. The electronic device as claimed in claim 1, wherein the light-emitting unit further has a connection feature, and the light-emitting chip is electrically connected to the thin-film transistor through the connection feature.

3. The electronic device as claimed in claim 2, wherein the light-emitting unit further has a packaging substrate, and the light-emitting chip is disposed on the packaging substrate.

4. The electronic device as claimed in claim 3, wherein the packaging substrate has a sidewall surrounding the light-emitting chip.

5. The electronic device as claimed in claim 1, wherein the encapsulating glue comprises an encapsulating material, and phosphor powders, quantum dots, or light-diffusing particles distributed in the encapsulating material.

6. The electronic device as claimed in claim 1, further comprising:

an insulating layer disposed on the plurality of thin-film transistors; and

a plurality of conductive pads disposed on the insulating layer, wherein one of the plurality of conductive pads is electrically connected to one of the plurality of thin-film transistors through a conductive layer penetrating the insulating layer.

7. The electronic device as claimed in claim 6, further comprising:

a conductive medium electrically connected to the light-emitting unit and the conductive pads.

8. The electronic device as claimed in claim 7, wherein the conductive medium overlaps the conductive pads in a normal direction of the substrate.

9. The electronic device as claimed in claim 6, wherein the substrate comprises a bendable portion.

10. The electronic device as claimed in claim 9, further comprising:

a conductive line disposed on the bendable portion, wherein the conductive line has an undulating edge or at least one opening.

11. The electronic device as claimed in claim 9, wherein the substrate further comprises a non-bending portion adjacent to the bendable portion, wherein a thickness of the insulating layer on the non-bending portion is less than a thickness of the insulating layer on the bendable portion.

12. The electronic device as claimed in claim 6, wherein the insulating layer comprises an organic photoresist material.

13. The electronic device as claimed in claim 6, wherein the insulating layer is in direct contact with a bendable portion of the substrate.

14. The electronic device as claimed in claim 1, wherein the thin-film transistor has an active layer, and the active layer does not overlap the light-emitting unit in a normal direction of the substrate.

15. The electronic device as claimed in claim 1, wherein the light-emitting unit comprises a first light-emitting chip of a first color, and a second light-emitting chip of a second color different from the first color.

16. The electronic device as claimed in claim 1, further comprising:

an insulating layer disposed on the plurality of thin-film transistors; and

a first conductive pad and a second conductive pad, wherein at least a portion of the insulating layer is disposed between the first conductive pad and the second conductive pad, and the light-emitting unit is electrically connected to the thin-film transistor through the first conductive pad and the second conductive pad.

17. The electronic device as claimed in claim 16, wherein the first conductive pad and the second conductive pad extend into the insulating layer.

18. The electronic device as claimed in claim 1, further comprising a composite substrate, wherein the composite substrate includes a sub-layer and the substrate.

19. The electronic device as claimed in claim 18, wherein a ductility of the substrate is greater than a ductility of the sub-layer.

20. The electronic device as claimed in claim 18, wherein the sub-layer includes an opening to exposure the substrate.