METHOD FOR PRODUCING A TRANSISTOR
First Claim
1. A method for production of a transistor, in particular of a gallium-nitride transistor based on high electron mobility, in which the following steps are carried out:
- making available a substrate, which has multiple active layers on a carrier material, above which layers contact regions for a drain contact and a source contact are configured, wherein the region between the source contact and the drain contact is covered with a first insulation layer,forming a structured metal layer in a first gate region, by means of a temporarily formed structured first photoresist layer,depositing a second insulation layer,depositing an intermediate layer,structuring a second photoresist layer, so as to expose a second gate region, the lateral expanse of which is smaller than that of the first gate region,removing the first intermediate layer, the second insulation layer, and the metal layer in the second gate region by means of the second photoresist layer, so that a first field plate and a second field plate are formed on both sides of the second gate region,removing the second photoresist layer,forming lateral spacers that narrow toward one another toward the substrate surface in the second gate region, andforming a gate electrode after partial removal of the first insulation layer, with a gate foot between the spacers and a gate head that partially covers the metal layer and the first insulation layer.
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Accused Products
Abstract
A method produces a transistor, in particular a gallium nitride transistor based on high electron mobility. After a structured metal layer has been formed in a first gate region by a temporarily formed structured first photoresist layer, an intermediate layer has been deposited and a second insulation layer has been deposited, a second photoresist layer is structured in order to expose a second gate region, wherein subsequently a first field plate and a second field plate are formed as buried field plates on respective sides of the second gate region.
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12 Claims
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1. A method for production of a transistor, in particular of a gallium-nitride transistor based on high electron mobility, in which the following steps are carried out:
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making available a substrate, which has multiple active layers on a carrier material, above which layers contact regions for a drain contact and a source contact are configured, wherein the region between the source contact and the drain contact is covered with a first insulation layer, forming a structured metal layer in a first gate region, by means of a temporarily formed structured first photoresist layer, depositing a second insulation layer, depositing an intermediate layer, structuring a second photoresist layer, so as to expose a second gate region, the lateral expanse of which is smaller than that of the first gate region, removing the first intermediate layer, the second insulation layer, and the metal layer in the second gate region by means of the second photoresist layer, so that a first field plate and a second field plate are formed on both sides of the second gate region, removing the second photoresist layer, forming lateral spacers that narrow toward one another toward the substrate surface in the second gate region, and forming a gate electrode after partial removal of the first insulation layer, with a gate foot between the spacers and a gate head that partially covers the metal layer and the first insulation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification