OPTOELECTRONIC COMPONENT, A MODULE HAVING AT LEAST TWO OPTOELECTRONIC COMPONENTS, AND A METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

• US 20190326482A1
• Filed: 11/29/2017
• Published: 10/24/2019
• Est. Priority Date: 12/05/2016
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Brick, Peter, Streppel, Ulrich, Wiesmann, Christopher
• Granted Patent: US 11,177,416 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An optoelectronic component may include at least one semiconductor chip for emitting electromagnetic radiation, a conversion element, and an optical element. The conversion element may at least partially convert primary radiation emitted by the semiconductor chip(s) into secondary radiation where the conversion element is arranged downstream of the semiconductor chip(s) in the emission direction and is arranged on the semiconductor chip(s). The optical element may be arranged downstream of the conversion element in the emission direction and where the conversion element is subdivided into individual portions.

Claims

1. An optoelectronic component comprising:

at least one semiconductor chip for emitting electromagnetic radiation,

a conversion element for at least partial conversion of the primary radiation emitted by the at least one semiconductor chip into secondary radiation, wherein the conversion element is arranged downstream of the at least one semiconductor chip in the emission direction and is arranged on the at least one semiconductor chip, and

an optical element arranged downstream of the conversion element in the emission direction, wherein the conversion element is subdivided into individual portions.

2. The optoelectronic component as claimed in claim 1,

wherein the at least one semiconductor chip comprises regions with different emission power of the electromagnetic radiation.

3. The optoelectronic component as claimed in claim 1,

wherein the at least one semiconductor chip has an increased emission power of the electromagnetic radiation at the regions on which the portions of the conversion element are arranged.

4. The optoelectronic component as claimed in claim 1,

wherein the at least one semiconductor chip comprises selectively drivable regions.

5. The optoelectronic component as claimed in claim 1,

wherein the at least one semiconductor chip is structured.

6. The optoelectronic component as claimed in claim 1,

wherein one or more faces of the portions of the conversion element which face away from the at least one semiconductor chip are rectangular.

7. The optoelectronic component as claimed in claim 1,

wherein the portions of the conversion element are cuboid.

8. The optoelectronic component as claimed in claim 1,

wherein the distance between the at least one semiconductor chip and the optical element is less than 500 μ

m.

9. The optoelectronic component as claimed in claim 1,

wherein the optical element is an array of a multiplicity of optical microelements.

10. The optoelectronic component as claimed in claim 9,

wherein each portion of the conversion element is assigned an optical microelement.

11. The optoelectronic component as claimed in claim 9,

wherein the optical element comprises an array of microlenses.

12. The optoelectronic component as claimed in claim 9,

wherein the optical element comprises an array of microreflectors.

13. The optoelectronic component as claimed in claim 1,

wherein the optical element is arranged at a distance from the conversion element.

14. The optoelectronic component as claimed in claim 1, wherein the optoelectronic component comprises a planar upper side formed by the optical element or by encapsulation.

15. A module comprising at least two optoelectronic components;

wherein each of the at least two optoelectronic components comprises;

at least one semiconductor chip for emitting electromagnetic radiation,

a conversion element for at least partial conversion of the primary radiation emitted by the at least one semiconductor chip into secondary radiation, wherein the conversion element is arranged downstream of the at least one semiconductor chip in the emission direction and is arranged on the at least one semiconductor chip, and

an optical element arranged downstream of the conversion element in the emission direction, wherein the conversion element is subdivided into individual portions

wherein two or more of the semiconductor chips of the at least two optoelectronic components have different emission spectra.

16. A method for producing an optoelectronic component comprising:

providing a semiconductor chip,

applying a flat conversion layer on the semiconductor chip, and

selectively removing the conversion layer in order to subdivide the conversion layer into individual portions.