SEMICONDUCTOR DEVICE

• US 20190326511A1
• Filed: 10/28/2018
• Published: 10/24/2019
• Est. Priority Date: 04/23/2018
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: LEE, Kyung Hwan, KANG, Chang Seok, KIM, Yong-Seok, KANAMORI, Kohji, KIM, Hui Jung, LIM, Jun Hee
• Application Number:
  US16/172,830
• Publication Number:
  US 20190326511A1
• Time in Patent Office: Days
• CPC Class Codes: G11C 11/39 using thyristors or the avalanche or negative resistance type, e.g. PNPN, SCR, SCS, UJT
• CPC Class Codes: H01L 27/1027 Thyristors
• CPC Class Codes: H10B 63/20 comprising selection components having two electrodes, e.g. diodes
• CPC Class Codes: H10B 63/845 the switching components being connected to a common vertical conductor
• CPC Class Codes: H10N 70/231 based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
• CPC Class Codes: H10N 70/253 having three or more terminals, e.g. transistor-like devices
• CPC Class Codes: H10N 70/8828 Tellurides, e.g. GeSbTe

Abstract

A semiconductor device includes interlayer insulating layers and horizontal structures alternately and repeatedly disposed on a semiconductor substrate, separation structures extending in a direction perpendicular to an upper surface of the semiconductor substrate on the semiconductor substrate, to extend in a first horizontal direction parallel to the upper surface of the semiconductor substrate, and vertical structures disposed between the separation structures. Each of the horizontal structures includes a plurality of semiconductor regions, and the plurality of semiconductor regions of each of the plurality of semiconductor regions include a first semiconductor region and a second semiconductor region sequentially arranged in a direction away from a side surface of a corresponding one of the vertical structures and having different conductivity types.

Claims

1. A semiconductor device comprising:

a vertical structure disposed on a semiconductor substrate and extending in a direction perpendicular to an upper surface of the semiconductor substrate; and

a horizontal structure connected to a side surface of the vertical structure, and parallel to the upper surface of the semiconductor substrate,

wherein the horizontal structure includes a plurality of semiconductor regions sequentially arranged, in a direction away from the side surface of the vertical structure and parallel to the upper surface of the semiconductor substrate, and the plurality of semiconductor regions form at least one PN junction.

2. The semiconductor device of claim 1, wherein the plurality of semiconductor regions comprise a first semiconductor region, a second semiconductor region, a third semiconductor region, and a fourth semiconductor region,

wherein the first semiconductor region, the second semiconductor region, the third semiconductor region, and the fourth semiconductor region are sequentially arranged in a direction away from the side surface of the vertical structure and parallel to the upper surface of the semiconductor substrate,

wherein the first and third semiconductor regions have a first conductivity type,

wherein the second and fourth semiconductor regions have a second conductivity type different from the first conductivity type, and

wherein the first to fourth semiconductor regions constitute a PNPN thyristor memory cell.

3. The semiconductor device of claim 1, wherein the horizontal structure further comprises a first conductive pattern, and the plurality of semiconductor regions are disposed between the first conductive pattern and the side surface of the vertical structure.

4. The semiconductor device of claim 3, wherein the horizontal structure further comprises a data storage element disposed between the plurality of semiconductor regions and the first conductive pattern,

wherein the data storage element comprises a resistance variable element,

wherein the plurality of semiconductor regions comprise a first semiconductor region and a second semiconductor region sequentially arranged in a direction away from the side surface of the vertical structure and parallel to the upper surface of the semiconductor substrate, and

wherein the first semiconductor region and the second semiconductor region form a PN diode.

5. The semiconductor device of claim 3, further comprising a second conductive pattern electrically connected to the vertical structure,

wherein the first conductive pattern extends in a first horizontal direction parallel to the upper surface of the semiconductor substrate, and

wherein the second conductive pattern extends in a second horizontal direction parallel to the upper surface of the semiconductor substrate and perpendicular to the first horizontal direction.

6. The semiconductor device of claim 5, wherein the horizontal structure forms a memory cell of the semiconductor device,

wherein the memory cell is connected to a bit line and a word line, and

wherein the first conductive pattern comprises one of the bit line and the word line and the second conductive pattern comprises the other of the bit line and the word line.

7. The semiconductor device of claim 1, wherein a first semiconductor region of the plurality of semiconductor regions adjacent to the vertical structure is formed of an epitaxial semiconductor material epitaxially grown from a crystalline semiconductor material, a polysilicon material or a polysilicon-germanium material.

8. The semiconductor device of claim 1, wherein the vertical structure comprises an internal pattern and an external pattern disposed between the internal pattern and the horizontal structure and covering a bottom surface of the internal pattern,

wherein the internal pattern is formed of a material having higher electrical conductivity than electrical conductivity of the external pattern, and

wherein the external pattern is disposed between the internal pattern and the horizontal structure.

9. The semiconductor device of claim 1, wherein the vertical structure comprises a semiconductor layer formed by depositing the semiconductor layer to fill a trench.

10. A semiconductor device comprising:

interlayer insulating layers and horizontal structures alternately and repeatedly stacked on a semiconductor substrate; and

vertical structures disposed on a semiconductor substrate and extending in a direction perpendicular to an upper surface of the semiconductor substrate,

wherein each of the horizontal structures includes a plurality of semiconductor regions and a first conductive pattern adjacent to the plurality of semiconductor regions,

wherein the plurality of semiconductor regions of each of the horizontal structures include a first semiconductor region and a second semiconductor region, sequentially arranged in a direction away from a side surface of a corresponding one of the vertical structures and having different conductivity types, and

wherein each first conductive pattern is spaced apart from a corresponding one of the vertical structures.

11. The semiconductor device of claim 10, wherein each of the vertical structures comprises an internal pattern having a pillar shape, and an external pattern disposed between the internal pattern and the horizontal structures and covering a bottom surface of the internal pattern.

12. The semiconductor device of claim 11, wherein the external pattern is in contact with the first semiconductor region.

13. The semiconductor device of claim 10, further comprising second conductive patterns electrically connected to respective vertical structures and disposed either above the vertical structures or below the interlayer insulating layers and the horizontal structures.

14. The semiconductor device of claim 13, wherein the horizontal structures form a plurality of memory cells of the semiconductor device, further comprising:

a peripheral circuit configured to control an operation of the memory cells,

wherein the peripheral circuit is disposed either below or above the interlayer insulating layers, the horizontal structures, and the vertical structures.

15. A semiconductor device comprising:

interlayer insulating layers and horizontal structures alternately and repeatedly disposed on a semiconductor substrate;

separation structures disposed between the horizontal structures, extending in a direction perpendicular to an upper surface of the semiconductor substrate on the semiconductor substrate, and extending in a first horizontal direction parallel to the upper surface of the semiconductor substrate; and

vertical structures disposed between the separation structures,

wherein each of the horizontal structures includes a plurality of semiconductor regions, and

wherein the plurality of semiconductor regions of each of the plurality of semiconductor regions include a first semiconductor region and a second semiconductor region sequentially arranged in a direction away from a side surface of a corresponding one of the vertical structures and having different conductivity types.

16. The semiconductor device of claim 15, further comprising partition walls disposed between the separation structures and between the vertical structures,

wherein the partition walls extend in a direction perpendicular to the upper surface of the semiconductor substrate.

17. The semiconductor device of claim 16, wherein the plurality of semiconductor regions are disposed between the partition walls.

18. The semiconductor device of claim 16, wherein the horizontal structures further comprise conductive patterns, and the conductive patterns are interposed between the separation structures and the plurality of semiconductor regions, and are interposed between the separation structures and the partition walls.

19. The semiconductor device of claim 18, further comprising data storage elements disposed between the plurality of semiconductor regions and the conductive patterns,

wherein the data storage element includes at least one of a transition metal oxide layer, a phase change material layer, a solid electrolyte layer, and a polymer layer.

20. The semiconductor device of claim 15, further comprising a lower insulating layer disposed on the semiconductor substrate and disposed below the interlayer insulating layers and the horizontal structures,

wherein the lower insulating layer is formed of a material different from a material of the interlayer insulating layers.

21-25. -25. (canceled)