PLANE ANTENNA, CO-FIRED CERAMIC SUBSTRATE, AND QUASI-MILLIMETER-WAVE/MILLIMETER-WAVE WIRELESS COMMUNICATION MODULE

• US 20190326671A1
• Filed: 06/29/2017
• Published: 10/24/2019
• Est. Priority Date: 06/30/2016
• Status: Abandoned Application

• Current Assignee: Hitachi Metals (Thailand) Ltd.
• Original Assignee: Hitachi Metals (Thailand) Ltd.
• Inventors: HAYASHI, Kenji, ENOKI, Masato
• Application Number:
  US16/312,706
• Publication Number:
  US 20190326671A1
• Time in Patent Office: Days
• CPC Class Codes: C23C 14/10 Glass or silica
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 19/005 Patch antenna using one or more coplanar parasitic elements
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

A planar antenna includes: a multilayer ceramic structure 10 having an upper surface and a lower surface and including a plurality of ceramic layers stacked with each other; at least one radiation conductor 31 located at one of interfaces between the ceramic layers 10; and a ground conductor 32 located on the lower surface of the multilayer ceramic structure or at one of the interfaces between the ceramic layers that is on a lower surface side of the radiation conductor.

Claims

1-22. -22. (canceled)

23. A planar antenna comprising:

a multilayer ceramic structure having an upper surface and a lower surface and including a plurality of ceramic layers stacked with each other;

at least one radiation conductor located at one of interfaces between the ceramic layers; and

a ground conductor located on the lower surface of the multilayer ceramic structure or at one of the interfaces between the ceramic layers that is on a lower surface side of the radiation conductor.

24. The planar antenna according to claim 23, wherein of the ceramic layers, the multilayer ceramic structure includes a first portion that is located between the upper surface and the at least one radiation conductor and a second portion that is located between the lower surface and the at least one radiation conductor.

25. The planar antenna according to claim 24, wherein a thickness of the first portion is 70 μ

m or less.

26. The planar antenna according to claim 24, wherein the first portion of the multilayer ceramic structure has a composition different from the second portion.

27. The planar antenna according to claim 24, wherein the first portion of the multilayer ceramic structure has the same composition as the second portion.

28. The planar antenna according to claim 23, comprising a plurality of radiation conductors.

29. The planar antenna according to claim 23, wherein an interval between the radiation conductor and the ground conductor is 50 μ

m or more and 1 mm or less.

30. The planar antenna according to claim 23, wherein:

the radiation conductor is buried in the first portion and the second portion; and

a height Hc of a portion of the radiation conductor that is buried in the first portion 10c is smaller than a height Hd of a portion of the radiation conductor that is buried in the second portion 10d.

31. A co-fired ceramic substrate comprising:

a multilayer ceramic structure having an upper surface and a lower surface and including a plurality of ceramic layers stacked with each other;

at least one radiation conductor located at one of interfaces between the ceramic layers;

a ground conductor located on the lower surface of the multilayer ceramic structure or at one of the interfaces between the ceramic layers that is on a lower surface side of the radiation conductor;

a plurality of conductor patterns located at one of the interfaces between the ceramic layers that is on a lower surface side of the radiation conductor; and

a plurality of conductive vias provided in one of the ceramic layers that is located on a lower surface side of the radiation conductor, wherein;

a planar antenna is formed by the radiation conductor, the ground conductor, and a portion of the ceramic layers located between the radiation conductor and the ground conductor; and

the conductor patterns and the conductive vias form a passive element and a wire.

32. The co-fired ceramic substrate according to claim 31, wherein of the ceramic layers, the multilayer ceramic structure includes a first portion that is located between the upper surface and the at least one radiation conductor and a second portion that is located between the lower surface and the at least one radiation conductor.

33. The co-fired ceramic substrate according to claim 32, wherein a thickness of the first portion is 70 μ

m or less.

34. The co-fired ceramic substrate according to claim 31, wherein an interval between the radiation conductor and the ground conductor is 50 μ

m or more and 1 mm or less.

35. The co-fired ceramic substrate according to a claim 31, wherein:

the radiation conductor is buried in the first portion and the second portion; and

a height He of a portion of the radiation conductor that is buried in the first portion 10c is smaller than a height Hd of a portion of the radiation conductor that is buried in the second portion 10d.

36. The co-fired ceramic substrate according to claim 32, wherein the first portion of the multilayer ceramic structure has a composition different from the second portion.

37. The co-fired ceramic substrate according to claim 32, wherein the first portion of the multilayer ceramic structure has the same composition as the second portion.

38. The co-fired ceramic substrate according to claim 31, comprising a plurality of radiation conductors.

39. The co-fired ceramic substrate according to claim 31, further comprising at least one of a conductive via and a conductive pattern that is formed in the multilayer ceramic structure and that directly electrically connects together the radiation conductor and the wire.

40. The co-fired ceramic substrate according to claim 31, further comprising at least one of a conductive via and a conductive pattern that is formed in the multilayer ceramic structure, that is electrically connected to the wire, and that can be electromagnetically coupled to the radiation conductor.

41. The co-fired ceramic substrate according to claim 40, further comprising a plurality of electrodes that are located on the lower surface and that are electrically connected to the wire.

42. A quasi-millimeter wave/millimeter wave wireless communication module comprising:

the co-fired ceramic substrate according to claim 41; and

an active element that is connected to the electrodes located on the lower surface of the multilayer ceramic structure.