HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD
First Claim
1. A highly conductive transparent glass-based circuit board, comprising:
- a glass substrate, being a glass-tempered substrate,wherein a surface of the glass-tempered substrate faces air, and a conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate;
wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion;
wherein a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer;
wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75;
3;
5 to 10;
10 to 20;
1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; and
wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste.
2 Assignments
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Accused Products
Abstract
A highly conductive transparent glass-based circuit board includes a glass substrate. The glass substrate is a glass-tempered substrate. A surface of the glass-tempered substrate faces air. A conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass-tempered substrate. The surface of the glass-tempered substrate and an upper surface of the conductive circuit are at the same level. A surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer. The conductive circuit is tightly fused with the glass substrate. It is a fusional relation between the conductive circuit and the glass substrate. A surface of the glass substrate and an upper surface of the conductive circuit are at the same level. Because a surface of the highly conductive transparent glass-based circuit board is smooth, the conductive circuit is not easily damaged. The highly conductive transparent glass-based circuit board has the characteristics of high conductivity and high transmittance.
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Citations
3 Claims
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1. A highly conductive transparent glass-based circuit board, comprising:
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a glass substrate, being a glass-tempered substrate, wherein a surface of the glass-tempered substrate faces air, and a conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate; wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion; wherein a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer; wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75;
3;
5 to 10;
10 to 20;
1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; andwherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste. - View Dependent Claims (2, 3)
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Specification