Active Electronically Steered Array with Waveguide Manifold Thermocoupled to ICS as a Heatsink
First Claim
1. A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) comprising:
- a metal plate including a first side and a second side;
a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB;
a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch waveguide and a plurality of slots that guide the direction of the wave transmission; and
wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.
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Accused Products
Abstract
A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch waveguide and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.
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Citations
5 Claims
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1. A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) comprising:
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a metal plate including a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch waveguide and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation. - View Dependent Claims (2, 3, 4, 5)
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Specification