×

THREE-DIMENSIONALLY SHAPED THERMALLY CONDUCTIVE MOLDED BODY, AND MANUFACTURING METHOD THEREOF

  • US 20190329455A1
  • Filed: 10/31/2017
  • Published: 10/31/2019
  • Est. Priority Date: 10/31/2016
  • Status: Active Application
First Claim
Patent Images

1. A three-dimensionally shaped thermally conductive molded body comprising a thermally conductive material and a silicone-based material, whereinthe molded body has a substantially flat bottom surface, and a three-dimensional shaped part located on the inside of the bottom surface, and the height of the three-dimensionally shaped part that is higher than the bottom surface differs in at least two locations.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×