THREE-DIMENSIONALLY SHAPED THERMALLY CONDUCTIVE MOLDED BODY, AND MANUFACTURING METHOD THEREOF

• US 20190329455A1
• Filed: 10/31/2017
• Published: 10/31/2019
• Est. Priority Date: 10/31/2016
• Status: Active Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Uchiya, Tomoaki, Sakaguchi, Ryo, Takashina, Tadahiro, Nezu, Masaru, Takenouchi, Takashi
• Application Number:
  US16/345,951
• Publication Number:
  US 20190329455A1
• Time in Patent Office: Days
• CPC Class Codes: B29B 11/06 by moulding the material
• CPC Class Codes: B29C 39/00 Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor B29C41/00 takes precedence
• CPC Class Codes: B29C 39/003 characterised by the choice of material
• CPC Class Codes: B29C 39/02 for making articles of definite length, i.e. discrete articles
• CPC Class Codes: B29C 39/026 characterised by the shape of the surface
• CPC Class Codes: B29C 39/10 incorporating preformed parts or layers, e.g. casting around inserts or for coating articles coating a surface by casting in general B05D1/30, B29C39/126 takes precedence
• CPC Class Codes: B29C 51/10 Forming by pressure difference, e.g. vacuum
• CPC Class Codes: B29K 2083/00 Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
• CPC Class Codes: B29K 2995/0013 Conductive
• CPC Class Codes: B29L 2031/18 Heat-exchangers or parts thereof
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: B32B 37/153 at least one layer is extruded and immediately laminated while in semi-molten state
• CPC Class Codes: F28F 3/04 the means being integral with the element
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/373 Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons

Abstract

Provided is a three-dimensionally shaped thermally conductive molded body and manufacturing method thereof, that can ensure sufficient gap filling properties and contact surface area with regard to heat dissipating components such as heat sinks and the like and heat generating components such as IC chips and the like, without adding excessive stress to these components. The three-dimensionally shaped thermally conductive molded body of a first aspect of the present disclosure contains a thermally conductive material and a silicone-based material, the molded body has a substantially flat bottom surface, and a three-dimensional shaped part located on the inside of the bottom surface, and the height of the three-dimensionally shaped part that is higher than the bottom surface differs in at least two locations.

Claims

1. A three-dimensionally shaped thermally conductive molded body comprising a thermally conductive material and a silicone-based material, wherein

the molded body has a substantially flat bottom surface, and a three-dimensional shaped part located on the inside of the bottom surface, and the height of the three-dimensionally shaped part that is higher than the bottom surface differs in at least two locations.

2. The three-dimensionally shaped thermally conductive molded body according to claim 1, wherein at least a portion of the three-dimensionally shaped part is covered by an upper part outer layer containing a silicone-based material.

3. The three-dimensionally shaped thermally conductive molded body according to claim 1, wherein a nonwoven material is internally provided on a side of the bottom surface.

4. The three-dimensionally shaped thermally conductive molded body according to claim 1, wherein at least a portion of the three-dimensionally shaped part has a substantially dome shape or a substantially domed prism shape.

5. The three-dimensionally shaped thermally conductive molded body according to claim 1, wherein the shape of the three-dimensionally shaped part substantially matches the shape of an adherend member to which the shaped part is applied.

6. The three-dimensionally shaped thermally conductive molded body according to claim 1, wherein the molded body includes a bottom part outer layer with the aforementioned bottom surface, an upper part outer layer provided so as to cover the bottom part outer layer, and a middle member provided between the bottom part outer layer and the upper part outer layer, with the upper part outer layer, middle member, and bottom part outer layer containing a silicone-based material.

7. The three-dimensionally shaped thermally conductive molded body according to claim 6, wherein the upper part outer layer and the bottom part outer layer, or the bottom part outer layer and the middle member are integrated and made of the same material.

8. The three-dimensionally shaped thermally conductive molded body according to claim 6, wherein the upper part outer layer contains silicone rubber, the middle member contains silicone gel, and the bottom part outer layer contains silicone rubber or silicone gel.

9. The three-dimensionally shaped thermally conductive molded body according to claim 6, wherein the middle member is more flexible than the upper part outer layer and/or the bottom part outer layer.

10. The three-dimensionally shaped thermally conductive molded body according to claim 1, wherein the tackiness differs between the bottom surface and a surface portion of the three-dimensionally shaped thermally conductive molded body excluding the bottom surface.

11. A method of manufacturing a three-dimensionally shaped thermally conductive molded body, comprising:

preparing a mixture containing a thermally conductive material and a silicone-based material;

preparing a mold that can provide a molded body with a substantially flat bottom surface, and a three-dimensional shaped part located on the inside of the bottom surface, and the height of the three-dimensionally shaped part that is higher than the bottom surface differs in at least two locations;

providing an extensible film on the mold so as to enable contact with the mold inner surface;

overlaying the extensible film on the mold;

filling the aforementioned mixture into a hollow part of the mold on which the extensible film has been overlaid, and performing a smoothing process of an optional portion that forms the bottom surface of the molded body;

curing the mixture in the mold; and

providing the three-dimensionally shaped thermally conductive molded body by removing the three-dimensionally shaped thermally conductive molded body with an extensible film, after optionally cooling the mold, and optionally punching out a portion that does not have the mold shape.

23. The method of manufacturing the three-dimensionally shaped thermally conductive molded body according to claim 11, wherein the extensible film includes at least one resin selected from polyolefin resins, polymethylpentene resins, ionomer resins, and fluorine-based resins.

12. A method of manufacturing a three-dimensionally shaped thermally conductive molded body, comprising:

forming the upper part outer layer by applying and curing a first silicone-based material containing a thermally conductive material on the extensible film of a laminate film containing an extensible film and a release film;

removing the release film of a laminate film having the upper part outer layer, and then placing the laminate film on the mold such that the extensible film can contact the inner surface of the mold, where the mold is a mold that can provide a molded body with a substantially flat bottom surface and a three-dimensional shaped part located on the inside of the bottom surface, and the height of the three-dimensionally shaped part that is higher than the bottom surface differs in at least two locations;

overlaying the laminate film on the mold;

filling the middle member containing a second silicone-based material including a thermally conductive material into a hollow part of the mold on which the extensible film was overlaid, and optionally performing a smoothing process of a portion positioned on the bottom surface side of the molded body;

forming the bottom part outer layer by applying a third silicone-based material containing a thermally conductive material onto the release film and placing the release film containing the bottom part outer layer on the mold such that the release film is an outermost layer, such that the bottom part outer layer covers the upper part outer layer and the middle member filled in the hollow part;

curing the second silicone-based material that forms the middle member and the third silicone-based material including the bottom part outer layer if present;

providing the three-dimensionally shaped thermally conductive molded body by optionally cooling the mold, removing the three-dimensionally shaped thermally conductive molded body with an extensible film and a release film if present from the mold, optionally removing the extensible film and/or the optional release film if present, and optionally punching out the upper part outer layer portion that does not include the middle member and the bottom part outer layer portion if present.

24. The method of manufacturing the three-dimensionally shaped thermally conductive molded body according to claim 12, wherein the extensible film includes at least one resin selected from polyolefin resins, polymethylpentene resins, ionomer resins, and fluorine-based resins.

13-22. -22. (canceled)