LIQUID EJECTION HEAD SUBSTRATE, METHOD OF MANUFACTURING LIQUID EJECTION HEAD SUBSTRATE, AND LIQUID EJECTION HEAD

• US 20190329549A1
• Filed: 04/12/2019
• Published: 10/31/2019
• Est. Priority Date: 04/27/2018
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Ishida, Yuzuru, Kato, Maki, Misumi, Yoshinori, Funabashi, Tsubasa, Matsui, Takahiro
• Granted Patent: US 11,020,966 B2
• Time in Patent Office: Days
• CPC Class Codes: B41J 2/14072 Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
• CPC Class Codes: B41J 2/14129 Layer structure
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2202/18 Electrical connection established using vias

Abstract

A liquid ejection head substrate including a base including a surface having a first and second heat generation elements, a conductive first covering portion, a conductive second covering portion, an insulating layer disposed between the first heat generation element and the first covering portion, and between the second heat generation element and the second covering portion, a fuse portion, first wiring electrically connected to the first covering portion through the fuse portion, the first wiring electrically connecting the first covering portion to the second covering portion, a terminal electrically connected to the first covering portion and the second covering portion through the first wiring, second wiring, and electric connection portions provided between the fuse portion and the terminal in a current path passing through the first wiring, the electric connection portions parallelly connecting the first and second wiring to each other.

Claims

1. A liquid ejection head substrate comprising:

a base including a surface in which a first heat generation element and a second heat generation element that generate heat to eject liquid are provided;

a conductive first covering portion that covers the first heat generation element,

a conductive second covering portion that covers the second heat generation element;

an insulating layer disposed between the first heat generation element and the first covering portion, and between the second heat generation element and the second covering portion;

a fuse portion;

first wiring electrically connected to the first covering portion through the fuse portion, the first wiring electrically connecting the first covering portion and the second covering portion to each other;

a terminal electrically connected to the first covering portion and the second covering portion through the first wiring;

second wiring provided at a position different from that of the first wiring in an orthogonal direction with respect to the surface of the base; and

a plurality of electric connection portions provided between the fuse portion and the terminal in a path of current passing through the first wiring, the plurality of electric connection portions connecting the first wiring and the second wiring to each other in parallel.

2. The liquid ejection head substrate according to claim 1, further comprising:

an element row in which a plurality of heat generation elements including the first heat generation element and the second heat generation element are arranged, p1 wherein the first wiring and the second wiring extend in an element row direction.

3. The liquid ejection head substrate according to claim 2,

wherein the electric connection portions are provided at both end portions of the first wiring in the element row direction.

4. The liquid ejection head substrate according to claim 2, further comprising:

a plurality of covering portions that include the first covering portion and the second covering portion and that cover the plurality of heat generation elements; and

a row of fuse portions in which fuse portions that connect the plurality of covering portions and the first wiring to each other are provided in the element row direction,

wherein at least one of the plurality of electric connection portions includes a portion positioned on an outer side of the row of fuse portions in a row direction.

5. The liquid ejection head substrate according to claim 1,

wherein the second covering portion is electrically connected to the first wiring through another fuse portion other than the fuse portion, and

wherein the electric connection portions are provided so as to correspond to the fuse portion and the another fuse portion other than the fuse portion.

6. The liquid ejection head substrate according to claim 1,

wherein a sheet resistance of the second wiring is lower than a sheet resistance of the first wiring.

7. The liquid ejection head substrate according to claim 1,

wherein the insulating layer is disposed between the first wiring and the second wiring in the orthogonal direction, and

wherein at least a portion of each of the plurality of electric connection portions is provided so as to penetrate the insulating layer.

8. The liquid ejection head substrate according to claim 1,

wherein when viewed in the orthogonal direction, the first wiring and the second wiring overlap each other at least partially.

9. The liquid ejection head substrate according to claim 8,

wherein in the orthogonal direction, the second wiring, the insulating layer, and the first wiring are disposed in that order from a base side, and

wherein the first wiring covers a step portion of the insulating layer that covers an end portion of the second wiring.

10. The liquid ejection head substrate according to claim 1,

wherein the second wiring is constituted by a material that is the same as that of at least one terminal forming layer constituting the terminal, and is configured as the same layer as the at least one terminal forming member in the orthogonal direction.

11. The liquid ejection head substrate according to claim 1,

wherein the plurality of electric connection portions are provided as layers that are different from the first wiring and the second wiring.

12. The liquid ejection head substrate according to claim 11,

wherein the first wiring is positioned farther from the base than the second wiring in the orthogonal direction, and

wherein the plurality of electric connection portions connect a surface of the first wiring on an opposite side with respect to a surface thereof opposing the second wiring, and a surface of the second wiring opposing the second wiring to each other.

13. The liquid ejection head substrate according to claim 11,

wherein the plurality of electric connection portions are constituted by a material that is the same as that of at least one terminal forming layer constituting the terminal, and are configured as the same layer as the at least one terminal forming member in the orthogonal direction.

14. The liquid ejection head substrate according to claim 1,

wherein the insulating layer is disposed between the first wiring and the second wiring in the orthogonal direction, and

wherein the plurality of electric connection portions are constituted by having the first wiring and the second wiring be in contact with each other through a plurality of through holes provided in the insulating layer.

15. A method of manufacturing a liquid ejection head substrate including

a base including a first heat generation element and a second heat generation element that generate heat to eject liquid,

a conductive first covering portion that covers the first heat generation element,

a conductive second covering portion that covers the second heat generation element,

an insulating layer disposed between the first heat generation element and the first covering portion, and between the second heat generation element and the second covering portion,

a fuse portion,

first wiring electrically connected to the first covering portion through the fuse portion, the first wiring electrically connecting the first covering portion and the second covering portion to each other, and

a terminal electrically connected to the first covering portion and the second covering portion through the first wiring,

the method of manufacturing a liquid ejection head substrate comprising;

preparing the base provided with a second wiring on a surface thereof;

forming the insulating layer so as to cover the second wiring;

forming the first wiring on the insulating layer; and

forming the plurality of electric connection portions in which at least a portion of each of the plurality of electric connection portions penetrate the insulating layer, in which the plurality of electric connection portions are provided between the fuse portion in the path of the current passing through the first wiring and the terminal, and in which the plurality of electric connection portions connect the first wiring and the second wiring to each other in parallel.

16. The method of manufacturing a liquid ejection head substrate according to claim 15,

wherein in the preparing of the base, a metal layer formed on the surface of the base is patterned and the second wiring and at least one terminal forming layer that constitutes the terminal are formed from the metal layer.

17. The method of manufacturing a liquid ejection head substrate according to claim 15,

wherein in forming the plurality of electric connection portions, at least a portion of the terminal forming layer constituting the terminal is formed together in the forming.

18. A liquid ejection head comprising:

a liquid ejection head substrate including

a base including a surface in which a first heat generation element and a second heat generation element that generate heat to eject liquid are provided,

a conductive first covering portion that covers the first heat generation element,

a conductive second covering portion that covers the second heat generation element,

an insulating layer disposed between the first heat generation element and the first covering portion, and between the second heat generation element and the second covering portion,

a fuse portion,

first wiring electrically connected to the first covering portion through the fuse portion, the first wiring electrically connecting the first covering portion and the second covering portion to each other, and

a terminal electrically connected to the first covering portion and the second covering portion through the first wiring; and

a flow passage forming member provided on a first covering portion side of the liquid ejection head substrate, the flow passage forming member forming, together with the liquid ejection head substrate, a flow passage through which the liquid is made to flow,

wherein the liquid ejection head substrate includes

second wiring provided at a layer different from that of the first wiring in an orthogonal direction with respect to the surface of the base, and

a plurality of electric connection portions provided between the fuse portion and the terminal in a path of current passing through the first wiring, the plurality of electric connection portions connecting the first wiring and the second wiring to each other in parallel.

19. The liquid ejection head according to claim 18,

wherein the plurality of electric connection portions are provided on a surface of the liquid ejection head substrate on a flow passage thrming member side, and

wherein the flow passage forming member convers at least a portion of the plurality of electric connection portions.

20. The liquid ejection head according to claim 19,

wherein the flow passage forming member is in contact with the plurality of electric connection portions.

21. The liquid ejection head according to claim 19,

wherein the flow passage forming member is provided so as to form a gap with the plurality of electric connection portions.