SILICON-CONTAINING HALOGENATED ELASTOMERS
First Claim
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1. A curable halogenated amorphous polymer composition comprising:
- (a) a halogenated amorphous polymer having at least 25% halogen by weight;
(b) at least 0.5 phr and less than 10 phr of an acid acceptor;
(c) at least 0.01 % and less than 10% by wt of a silicon-containing compound based on the weight of the halogenated amorphous polymer; and
(d) a dehydrohalogenation cure system.
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Abstract
Described herein is curable composition comprising a halogenated amorphous polymer having at least 25% halogen by weight; at least 0.5 phr of an acid acceptor; at least 0.01 phr of silicon-containing compound; and a dehydrohalogenation cure system. Upon curing, a silicon-containing superficial layer forms, which can provide increased durability, non-tackiness, and a matte finish to the cured elastomer.
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Citations
22 Claims
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1. A curable halogenated amorphous polymer composition comprising:
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(a) a halogenated amorphous polymer having at least 25% halogen by weight; (b) at least 0.5 phr and less than 10 phr of an acid acceptor; (c) at least 0.01 % and less than 10% by wt of a silicon-containing compound based on the weight of the halogenated amorphous polymer; and (d) a dehydrohalogenation cure system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 18, 19, 20, 21, 22)
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12. An article comprising
a halogenated elastomer having a superficial layer consisting of silicon, wherein the halogenated elastomer comprises at least 0.01 % and less than 10% by wt of silicon-containing inorganic compound in the bulk; - and there is a concentration gradient of silicon doixide, which decreases from the superficial layer toward the bulk.
- View Dependent Claims (17)
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13. (canceled)
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14. (canceled)
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15. (canceled)
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16. A cured article, the cured article obtainable by curing a composition comprising (a) a halogenated amorphous polymer having at least 25% halogen by weight, wherein the a halogenated amorphous polymer is partially halogenated;
- (b) at most 4 phr of an acid acceptor, wherein the acid acceptor is selected from an oxide or hydroxide of a divalent metal; and
(c) at least 0.05 and at most 5 phr of a silicon-containing compound, with a bisphenol cure system.
- (b) at most 4 phr of an acid acceptor, wherein the acid acceptor is selected from an oxide or hydroxide of a divalent metal; and
Specification