COMPOSITION FOR FORMING PROTECTIVE FILM FOR ELECTROCONDUCTIVE PATTERN, PROTECTIVE FILM FOR ELECTROCONDUCTIVE PATTERN, METHOD FOR PRODUCING PROTECTIVE FILM, AND METHOD FOR PRODUCING TRANSPARENT ELECTROCONDUCTIVE FILM

• US 20190330493A1
• Filed: 11/29/2017
• Published: 10/31/2019
• Est. Priority Date: 12/01/2016
• Status: Active Grant

• Current Assignee: Resonac Corp. (Resonac Holdings Corp.)
• Original Assignee: Showa Denko KK
• Inventors: TOBA, Masahiko, NAKAZAWA, Eri, YAMAKI, Shigeru
• Granted Patent: US 10,995,235 B2
• Time in Patent Office: Days
• CPC Class Codes: B05D 2503/00 Polyurethanes
• CPC Class Codes: B05D 2504/00 Epoxy polymers
• CPC Class Codes: B05D 2601/28 Metals
• CPC Class Codes: B05D 3/0254 After-treatment
• CPC Class Codes: B05D 5/12 to obtain a coating with specific electrical properties
• CPC Class Codes: C08G 18/0823 containing carboxylate salt groups or groups forming them
• CPC Class Codes: C08G 18/348 Hydroxycarboxylic acids
• CPC Class Codes: C08G 18/44 Polycarbonates
• CPC Class Codes: C08G 18/6659 with compounds of group C08G18/34
• CPC Class Codes: C08G 18/758 containing two or more cycloaliphatic rings
• CPC Class Codes: C09D 163/00 Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
• CPC Class Codes: C09D 175/04 Polyurethanes
• CPC Class Codes: C09D 175/06 from polyesters
• CPC Class Codes: C09D 7/20 Diluents or solvents
• CPC Class Codes: H01B 1/124 Intrinsically conductive polymers
• CPC Class Codes: H01B 13/00 Apparatus or processes specially adapted for manufacturing conductors or cables

Abstract

A composition for a protective film for electroconductive patterns, including: (A) a polyurethane containing a carboxyl group; (B) an epoxy compound; (C) a curing accelerator; and (D) a solvent, wherein the percentage of the solvent (D) contained is from 95.0% to 99.9% by mass, and the solvent (D) contains (D1) a solvent containing a hydroxyl group and having a boiling point in excess of 100° C., and (D2) a solvent having a boiling point that does not exceed 100° C., wherein the content of the solvent (D2) having a boiling point that does not exceed 100° C. is 30% to less than 70% by mass of total solvent in total. The composition can be cured by heating at a temperature not exceeding 100° C. for a heating time not exceeding 10 minutes.

Claims

1-8. -8. (canceled)

9. A composition for a protective film for a conductive pattern, comprising

(A) a polyurethane containing a carboxyl group,

(B) an epoxy compound,

(C) a curing accelerator, and

(D) solvent,

wherein the content of the solvent (D) is 95.0% by mass or more and 99.9% by mass or less, (D) comprises (D1) and (D2), (D1) being a solvent having a boiling point exceeding 100°

C. and containing a hydroxyl group, (D2) being a solvent having a boiling point of 100°

C. or lower, and the content of the solvent (D2) having the boiling point of 100°

C. or lower is 30% by mass or more and less than 70% by mass of the solvent in total.

10. A composition for a protective film for a conductive pattern according to claim 9, wherein (D1) solvent having the boiling point exceeding 100°

C. and containing a hydroxyl group is at least one selected from a group consisting of propylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol, and ethyl lactate.

11. A composition for a protective film for a conductive pattern according to claim 9, wherein (D2) solvent having the boiling point of 100°

C. or lower is at least one selected from a group consisting of propylene glycol dimethyl ether, isopropyl alcohol, t-butyl alcohol, and methyl ethyl ketone.

12. A composition for a protective film for a conductive pattern according to claim 10, wherein (D2) solvent having the boiling point of 100°

C. or lower is at least one selected from a group consisting of propylene glycol dimethyl ether, isopropyl alcohol, t-butyl alcohol, and methyl ethyl ketone.

13. A composition for a protective film for a conductive pattern according to claim 10, wherein (D1) solvent having the boiling point exceeding 100°

C. and containing a hydroxyl group is at least one of diethylene glycol monoethyl ether (EC) and propylene glycol monomethyl ether (PGME).

14. A composition for a protective film for a conductive pattern according to claim 11, wherein (D2) solvent having the boiling point of 100°

C. or lower is isopropyl alcohol (IPA).

15. A protective film for a conductive pattern which is made of a cured product of the composition for the protective film for the conductive pattern according to claim 9, and which has a cure degree of 45 or more.

16. A method for producing a protective film, wherein the composition for the protective film for the conductive pattern according to claim 9 is cured at a temperature of 100°

C. or lower and for a heating time of 10 minutes or less.

17. A method for producing a transparent conductive film comprising a step of forming the protective film on the transparent conductive film by the method according to claim 15.