RESIN COMPOSITION, ADHESIVE LAYER, AND CIRCUIT BOARD UTILIZING SAME

• US 20190330500A1
• Filed: 06/28/2018
• Published: 10/31/2019
• Est. Priority Date: 04/26/2018
• Status: Active Grant

• Current Assignee: Avary Holding (Shenzhen) Co., Limited., Qing Ding Precision Electronics (Huaian) Co.,Ltd.
• Original Assignee: Avary Holding (Shenzhen) Co., Limited., Qing Ding Precision Electronics (Huaian) Co.,Ltd.
• Inventors: SHEN, FU-YUN, LEI, CONG, HO, MING-JAAN, HSU, HSIAO-TING
• Granted Patent: US 10,745,595 B2
• Time in Patent Office: Days
• CPC Class Codes: C08F 210/02 Ethene
• CPC Class Codes: C08F 212/08 Styrene
• CPC Class Codes: C08F 236/06 Butadiene
• CPC Class Codes: C08F 2800/20 as weight or mass percentages
• CPC Class Codes: C08K 2003/285 Ammonium nitrates
• CPC Class Codes: C08K 3/28 Nitrogen-containing compounds
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08K 5/0066 Flame-proofing or flame-retarding additives
• CPC Class Codes: C08L 101/005 Dendritic macromolecules
• CPC Class Codes: C08L 33/08 Homopolymers or copolymers of acrylic acid esters
• CPC Class Codes: C08L 53/02 of vinyl-aromatic monomers and conjugated dienes
• CPC Class Codes: C08L 53/025 modified
• CPC Class Codes: C08L 71/12 Polyphenylene oxides
• CPC Class Codes: C09J 109/06 Copolymers with styrene
• CPC Class Codes: C09J 153/025 modified
• CPC Class Codes: H05K 1/0353 consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles

Abstract

A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.

Claims

1. A resin composition comprising:

a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight;

a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight;

a polyphenylene ether in 3 to 35 parts by weight; and

a dendritic acrylate oligomer in 3 to 45 parts by weight.

2. The resin composition of claim 1, wherein the resin composition further comprises heat-conducting powder in 5 to 150 parts by weight.

3. The resin composition of claim 2, wherein the heat-conducting powder is selected from a group consisting of silicon dioxide, aluminum trioxide, boron nitride, aluminum nitride, and any combination thereof.

4. The resin composition of claim 1, wherein the resin composition further comprises flame retardant in 5 to 250 parts by weight.

5. The resin composition of claim 1, wherein the resin composition further comprises an ion trapping agent in 0.5 to 10 parts by weight.

6. An adhesive layer formed by curing a resin composition, the resin composition comprising:

a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight;

a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight;

a polyphenylene ether in 3 to 35 parts by weight; and

a dendritic acrylate oligomer in 3 to 45 parts by weight.

7. The adhesive layer of claim 6, wherein the resin composition further comprises heat-conducting powder in 5 to 150 parts by weight.

8. The adhesive layer of claim 7, wherein the heat-conducting powder is selected from a group consisting of silicon dioxide, aluminum trioxide, boron nitride, aluminum nitride, and any combination thereof.

9. The adhesive layer of claim 6, wherein the resin composition further comprises a flame retardant in 5 to 250 parts by weight.

10. The adhesive layer of claim 6, wherein the resin composition further comprises an ion trapping agent in 0.5 to 10 parts by weight.

11. A circuit board comprising at least one adhesive layer, each adhesive layer formed by curing a resin composition, the resin composition comprising:

a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight;

a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight;

a polyphenylene ether in 3 to 35 parts by weight; and

a dendritic acrylate oligomer in 3 to 45 parts by weight.

12. The circuit board of claim 11, wherein the resin composition further comprises a heat-conducting powder in 5 to 150 parts by weight.

13. The circuit board of claim 12, wherein the heat-conducting powder is selected from a group consisting of silicon dioxide, aluminum trioxide, boron nitride, aluminum nitride, and any combination thereof.

14. The circuit board of claim 11, wherein the resin composition further comprises a flame retardant in 5 to 250 parts by weight.

15. The circuit board of claim 11, wherein the resin composition further comprises an ion trapping agent in 0.5 to 10 parts by weight.