METHOD FOR TEMPORARY BONDING WORKPIECE AND ADHESIVE

• US 20190330504A1
• Filed: 04/24/2019
• Published: 10/31/2019
• Est. Priority Date: 04/25/2018
• Status: Active Grant

• Current Assignee: Daxin Materials Corporation
• Original Assignee: Daxin Materials Corporation
• Inventors: LIN, Chi-Yen, LEE, Cheng-Wei, HUANG, Chun-Hung, LU, Hou-Te, LIAO, Yuan-Li
• Granted Patent: US 10,703,945 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 43/006 Delaminating
• CPC Class Codes: C08G 73/1039 comprising halogen-containing substituents
• CPC Class Codes: C08G 73/1046 Polyimides containing oxygen in the form of ether bonds in the main chain
• CPC Class Codes: C08G 73/106 containing silicon
• CPC Class Codes: C08G 73/1064 containing sulfur
• CPC Class Codes: C09J 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09J 2301/416 use of irradiation
• CPC Class Codes: C09J 2301/502 process for debonding adherents
• CPC Class Codes: C09J 2479/08 polyimide
• CPC Class Codes: C09J 5/00 Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: H01L 2221/68372 used to support a device or wafer when forming electrical connections thereto
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Abstract

A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.

Claims

1. A method for temporary bonding workpiece, comprising:

performing a combining step, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece;

performing a bonding step, wherein the substrate and the workpiece are bonded by the adhesive layer;

performing a processing step, wherein the workpiece is processed; and

performing a debonding step, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate;

wherein the adhesive layer is formed by an adhesive, the adhesive comprises a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %, the polymer is polyimide or a copolymer of amic acid/imide, a content of a hydroxyl-containing unit of a skeleton of the polymer is in a range of 5 wt % to 45 wt %, a content of an aliphatic ether-containing unit or a siloxane-containing unit of the skeleton of the polymer is in a range of 5 wt % to 40 wt %, and a cyclization ratio of the polymer is greater than or equal to 90%.

2. The method for temporary bonding workpiece of claim 1, wherein the combining step comprises:

performing a coating step, wherein the adhesive is coated on the surface of the substrate and/or the workpiece; and

performing a heating step, wherein the adhesive is heated so as to convert the adhesive into the adhesive layer.

3. The method for temporary bonding workpiece of claim 1, wherein the combining step comprises:

providing a composite film, wherein the composite film comprises a detachable substrate and an adhesive film, the adhesive film is disposed on a surface of the detachable substrate, and the adhesive film is obtained by the adhesive coated on the surface of the detachable substrate and then dried; and

performing a laminating step, wherein the surface of the substrate and/or the workpiece is contacted with the adhesive film of the composite film and heated so as to transfer the adhesive film to the surface of the substrate and/or the workpiece and convert into the adhesive layer.

4. The method for temporary bonding workpiece of claim 1, further comprises:

performing a dissolving step, wherein the adhesive layer remained on the workpiece is dissolved and removed by a cleaning solvent after the debonding step.

5. The method for temporary bonding workpiece of claim 4, wherein the solubility parameter of the cleaning solvent ranges from 9.6 to 12.8.

6. The method for temporary bonding workpiece of claim 1, wherein the workpiece is a chip, a wafer or a micro device for semiconductor manufacturing.

7. The method for temporary bonding workpiece of claim 1, wherein the aliphatic ether-containing unit is a poly aliphatic ether unit.

8. The method for temporary bonding workpiece of claim 1, wherein the siloxane-containing unit is a polysiloxane unit.

9. The method for temporary bonding workpiece of claim 1, wherein the light absorbing material is carbon black, titanium black, iron oxide, titanium nitride, an organic pigment or a dye.

10. An adhesive, comprising:

a polymer, wherein a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, the polymer is polyimide or a copolymer of amic acid/imide, a content of a hydroxyl-containing unit of a skeleton of the polymer is in a range of 5 wt % to 45 wt %, a content of an aliphatic ether-containing unit or a siloxane-containing unit of the skeleton of the polymer is in a range of 5 wt % to 40 wt %, and a cyclization ratio of the polymer is greater than or equal to 90%; and

a light absorbing material, wherein a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.

11. The adhesive of claim 10, wherein the hydroxyl-containing unit comprises a structure represented by formula (I-1), formula (I-2), formula (I-3), formula (I-4) or formula (I-5):

12. The adhesive of claim 11, wherein each X is independently the single bond, a alkylene group of 1 to 4 carbon atoms, —

CO—

, —

COO—

, —

O—

, —

SO₂—

or C(CF₃)₂.

13. The adhesive of claim 10, wherein the aliphatic ether-containing unit is a poly aliphatic ether unit.

14. The adhesive of claim 13, wherein the poly aliphatic ether unit comprises a segment represented by formula (II-1) or formula (II-2):

15. The adhesive of claim 10, wherein the siloxane-containing unit is a polysiloxane unit.

16. The adhesive of claim 15, wherein the polysiloxane unit comprises a segment represented by formula (III-1):

17. The adhesive of claim 10, wherein the light absorbing material is carbon black, titanium black, iron oxide, titanium nitride, an organic pigment or a dye.