Palladium-Based Alloys

• US 20190330713A1
• Filed: 07/11/2019
• Published: 10/31/2019
• Est. Priority Date: 01/29/2016
• Status: Active Grant

• Current Assignee: Deringer-Ney, Inc.
• Original Assignee: Deringer-Ney, Inc.
• Inventors: Klein, Arthur S., Smith, III, Edward F., Viswanathan, Srinath
• Granted Patent: US 11,041,228 B2
• Time in Patent Office: Days
• CPC Class Codes: C22C 5/04 Alloys based on a platinum group metal
• CPC Class Codes: G01R 1/06755 Material aspects

Abstract

Palladium-based ternary or higher alloys include palladium at about 45-55 wt %, copper about 32-42 wt %, silver at about 8-15 wt %, rhenium at about 0-5 wt %, and optionally one or more modifying elements at up to 1.0 wt %. The alloys are age-hardenable, provide hardness in excess of 350 HK (Knoop, 100 g load), have electrical conductivities above 19.5% IACS (International Annealed Copper Standard), have an elevated temperature strength above 100 ksi at temperatures up to 480° F. (250° C.), and remain ductile (tensile elongation>2%) in their fully age-hardened condition. The alloys may be used in static and moveable electrical contact and probe applications.

Claims

1. A palladium-based ternary or higher alloy, comprising:

(a) palladium at about 45-55 wt %;

(b) copper at about 32-42 wt %;

(c) silver at about 8-15 wt %;

(d) rhenium at about 1.1-5 wt %; and

wherein the alloy exhibits a second phase of rhenium,

wherein the alloy has a Pd;

Cu ratio of about 1.05 to 1.6 by weight,

wherein the alloy has a Pd;

Ag ratio of about 3 to 6 by weight, and

wherein a heat-treated electrical conductivity of the alloy exceeds 19.5% IACS.

2. The alloy of claim 1, wherein the palladium is present at about 51-55 wt %, the copper is present at about 32-40 wt %, the silver is present at about 8.5-14 wt %, and the rhenium is present at about 1.1-2.5 wt %.

3. The alloy of claim 1, wherein the palladium is present at about 51-55 wt %, the copper is present at about 32-40 wt %, the silver is present at about 8.5-14 wt %, and zinc is present at about 0.2-0.8 wt %.

4. The alloy of claim 1, wherein a heat-treated electrical conductivity of the alloy exceeds 25% IACS.

5. The alloy of claim 1, wherein a heat-treated hardness of the alloy is at least 350 Knoop.

6. The alloy of claim 1, wherein the alloy is free of one or more of:

nickel, chromium, gold, platinum, boron, or iron.

7. The alloy of claim 1, wherein the alloy is age-hardened and maintains a yield strength above 100 ksi at about 60°

F. to about 480°

F.

8. The alloy of claim 1, wherein the alloy is age-hardened and has a tensile elongation of greater than 2%.

9. The alloy of claim 1, wherein the alloy exhibits a tensile elongation that is greater than 6%.

10. The alloy of claim 1, further comprising greater than 0 wt % to 1.0 wt % modifying elements selected from the group consisting of:

ruthenium, zirconium, gallium, and zinc;

11. A semiconductor probe comprising a palladium-based ternary or higher alloy, the alloy comprising:

(a) palladium at about 45-55 wt %;

(b) copper at about 32-42 wt %;

(c) silver at about 8-15 wt %; and

(d) rhenium at about 1.1-5 wt %;

wherein the alloy exhibits a second phase of rhenium,

wherein the alloy has a Pd;

Cu ratio of about 1.05 to 1.6 by weight,

wherein the alloy has a Pd;

Ag ratio of about 3 to 6 by weight, and

wherein a heat-treated electrical conductivity of the alloy exceeds 19.5% IACS.

12. The semiconductor probe of claim 11, wherein the probe is configured as a Cobra probe, a cantilever probe, a vertical probe, or a pogo pin probe.

13. The semiconductor probe of claim 11, wherein the palladium is present at about 51-55 wt %, the copper is present at about 32-40 wt %, the silver is present at about 8.5-14 wt %, and the rhenium is present at about 1.1-2.5 wt %.

14. The semiconductor probe of claim 11, wherein a heat-treated electrical conductivity of the alloy exceeds 25% IACS.

15. A palladium-based ternary or higher alloy, consisting of:

(e) palladium at about 45-55 wt %;

(f) copper at about 32-42 wt %;

(g) silver at about 8-15 wt %;

(h) rhenium at about 1.1-5 wt %;

(i) up to 1.0 wt % modifying elements selected from the group consisting of;

ruthenium, zirconium, gallium, and zinc; and

(e) optionally, one or more impurities.

16. The alloy of claim 15, wherein the alloy exhibits a second phase of rhenium.

17. The alloy of claim 15, wherein the palladium is present at about 51-55 wt %, the copper is present at about 32-40 wt %, the silver is present at about 8.5-14 wt %, and the rhenium is present at about 1.1-2.5 wt %.

18. The alloy of claim 15, wherein a heat-treated electrical conductivity of the alloy exceeds 25% IACS.

19. The alloy of claim 15, wherein a heat-treated hardness of the alloy is at least 350 Knoop.

20. The alloy of claim 15, wherein the alloy is age-hardened and has a tensile elongation of greater than 2%.