ELECTRICAL ASSEMBLY SUBSTRATES FOR DOWNHOLE USE
First Claim
1. An apparatus for performing well logging in a borehole intersecting an earth formation, the apparatus comprising:
- a carrier conveyable in the borehole;
a tool disposed on the carrier comprising;
a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material;
at least two circuit elements selected from a circuit element comprising;
i) a terminal of a Gold (Au) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a AuSn solder join;
ii) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a high melting point (HMP) Sn/Ag based solder join;
iii) a terminal of a Tin (Sn) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a HMP Sn/Ag based solder join;
iv) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a sintered Ag join.
2 Assignments
0 Petitions
Accused Products
Abstract
Methods, systems, devices, and products for performing well logging in a borehole intersecting an earth formation. Apparatus include a carrier conveyable in the borehole; a tool disposed on the carrier. The tool comprises a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; and at least two terminals, each terminal attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a join.
3 Citations
18 Claims
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1. An apparatus for performing well logging in a borehole intersecting an earth formation, the apparatus comprising:
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a carrier conveyable in the borehole; a tool disposed on the carrier comprising; a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; at least two circuit elements selected from a circuit element comprising;
i) a terminal of a Gold (Au) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a AuSn solder join;
ii) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a high melting point (HMP) Sn/Ag based solder join;
iii) a terminal of a Tin (Sn) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a HMP Sn/Ag based solder join;
iv) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a sintered Ag join. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus for performing well logging in a borehole intersecting an earth formation, the apparatus comprising:
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a carrier conveyable in the borehole; a tool disposed on the carrier comprising; a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; at least two circuit elements selected from circuit elements comprising;
i) a Gold (Au) terminal material electrically monometallically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by Au wire;
ii) an Aluminum (Al) terminal material electrically monometallically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by Al wire;
iii) a Silver (Ag) terminal material electrically monometallically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by Ag wire. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method of performing well logging in a borehole intersecting an earth formation, the method comprising:
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conveying a carrier in the borehole, the carrier having disposed thereon a tool comprising; a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; at least two circuit elements selected from a circuit element comprising;
i) a terminal of a Gold (Au) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a AuSn solder join;
ii) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a high melting point (HMP) Sn/Ag based solder join;
iii) a terminal of a Tin (Sn) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a HMP Sn/Ag based solder join;
iv) a terminal of a Silver (Ag) terminal material electrically attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a sintered Ag join; andperforming well logging, including sending signals over the at least two circuit elements.
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Specification