TRANSPARENT HEAT EXCHANGER

• US 20190331440A1
• Filed: 07/08/2019
• Published: 10/31/2019
• Est. Priority Date: 10/05/2016
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Koontz, Christopher R., Filgas, David
• Granted Patent: US 11,092,392 B2
• Time in Patent Office: Days
• CPC Class Codes: F28F 21/00 Constructions of heat-exchange apparatus characterised by the selection of particular materials coatings for modifying heat-transfer F28F13/18; coatings for preventing the formation of deposits or corrosion F28F19/02
• CPC Class Codes: F28F 21/006 of glass
• CPC Class Codes: F28F 21/02 of carbon, e.g. graphite
• CPC Class Codes: F28F 21/04 of ceramic; of concrete; of natural stone
• CPC Class Codes: F28F 21/081 Heat exchange elements made from metals or metal alloys
• CPC Class Codes: F28F 2255/00 Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: F28F 3/04 the means being integral with the element
• CPC Class Codes: G02B 7/008 with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
• CPC Class Codes: G02B 7/1815 with cooling or heating systems cooling arrangements for laser mirrors H01S3/0401
• CPC Class Codes: H01S 3/0401 of optical elements being part of laser resonator, e.g. windows, mirrors, lenses
• CPC Class Codes: H01S 3/0405 Conductive cooling, e.g. by heat sinks or thermo-electric elements
• CPC Class Codes: H01S 3/0407 Liquid cooling, e.g. by water
• CPC Class Codes: H01S 3/2308 Amplifier arrangements, e.g. MOPA
• CPC Class Codes: H01S 5/02423 Liquid cooling, e.g. a liquid cools a mount of the laser
• CPC Class Codes: H01S 5/02438 Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
• CPC Class Codes: H01S 5/02476 Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements

Abstract

In one aspect, a transparent heat exchanger includes a first transparent substrate optically attached to a heat source, one or more fins to transfer heat from the heat source, the one or more fins comprising transparent material and further comprising one of a manifold coupled to the first transparent substrate or a facesheet coupled to the first transparent material.

Claims

1. A optical window comprising:

a first transparent substrate; and

a second transparent substrate optically bounded to the first transparent substrate and comprising one or more fins.

2. The window of claim 1, wherein the window is configured to pass a light signal through the first transparent substrate to the second transparent substrate through the second transparent substrate.

3. The optical window of claim 1, wherein the first transparent substrate comprises at least one of indium phosphate, silicon, silicon carbide, fused silica, sapphire or diamond.

4. The optical window of claim 1, wherein the second transparent substrate comprises at least one of indium phosphate, silicon, silicon carbide, fused silica, sapphire or diamond.

5. The optical window of claim 1, wherein the first transparent substrate and second transparent substrate create a heat exchanger assembly and seal the one or more channels at edges defined by fins,

wherein electromagnetic radiation is passed through the optical window.

6. A method to fabricate a transparent heat exchanger comprising:

optically bonding a first transparent substrate to a heat source;

forming one or more fins to transfer heat from the heat source, the one or more fins

comprising transparent material; and

coupling the first transparent substrate to one of a manifold or a facesheet.

7. The method of claim 6, wherein forming one or more fins comprises forming one or more fins in one of the first transparent substrate or a second substrate coupled to the heat source and the first substrate to transfer heat from the one or more fins to a coolant in contact with the one or more fins.