PHOTOMASK AND METHODS FOR MANUFACTURING AND CORRECTING PHOTOMASK

• US 20190332006A1
• Filed: 07/11/2019
• Published: 10/31/2019
• Est. Priority Date: 02/16/2009
• Status: Active Grant

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: NAGAI, Takaharu, MOHRI, Hiroshi, MORIKAWA, Yasutaka, HAYANO, Katsuya
• Granted Patent: US 10,634,990 B2
• Time in Patent Office: Days
• CPC Class Codes: G03F 1/28 with three or more diverse phases on the same PSM; Preparation thereof
• CPC Class Codes: G03F 1/30 Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
• CPC Class Codes: G03F 1/32 Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion,; Preparation thereof
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: G03F 1/44 Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
• CPC Class Codes: G03F 1/68 Preparation processes not covered by groups G03F1/20 - G03F1/50
• CPC Class Codes: G03F 1/72 Repair or correction of mask defects
• CPC Class Codes: G03F 1/80 Etching

Abstract

The present invention provides a halftone mask comprising an assist pattern and a manufacturing method of the halftone mask, which uses an ArF excimer laser as an exposing source, is used for a projection exposure by an off axis illumination, does not resolve the as pattern while keeping the focal depth magnification effect as the assist pattern, and may form a transferred image having high contrast of a main pattern. A photomask is a photomask comprising the main pattern which is transferred to a transfer-target surface by the projection exposure and the assist pattern which is formed nearby the main pattern and not transferred, characterized in that the main pattern and the assist pattern are each constituted from a semi-transparent film made of the same material, a retardation of 180° is generated between the light transmitting through the main pattern and the light transmitting through a transparent region of a transparent substrate, and a predetermined retardation within the scope of 70° to 115° is generated between the light transmitting through the assist pattern and the light transmitting through the transparent region of the transparent substrate.

Claims

1. A photomask comprising on a principal plane of a transparent substrate a main pattern transferred to a transfer-target surface by a projection exposure and an assist pattern formed nearby the main pattern and not transferred to the transfer-target surface;

wherein the main pattern and the assist pattern are each constituted from a semi-transparent film made of a same material; and

a film thickness of the assist pattern is thinner than a film thickness of the main pattern, and a film thickness difference is a predetermined film thickness difference within a scope of 24 nm to 40 nm.

2. The photomask according to claim 1, wherein the film thickness difference is formed by dry-etching.

3. The photomask according to claim 1, wherein an exposing light transmittance of the assist pattern is a predetermined transmittance within a scope of 15% to 29%.

1-1. photomask according to claim 1, wherein the semi-transparent film made of the same material is a single-layer semi-transparent film or a two-layer semi-transparent film.

6. The photomask according to claim 1, wherein a light shielding region is formed in an outer periphery of the photomask.

7. The photomask according to claim 1, wherein both the main pattern and the assist pattern are line patterns, and the main pattern is an isolated pattern or a periodic pattern.

8. The photomask according to claim 1, wherein a minimum pattern pitch of the main pattern on the transfer-target surface has a pitch of 120 nm or less.

5. The photomask according to claim 4, wherein the single-layer semi-transparent film is a semi-transparent film made of a molybdenum silicide-based material, and the two-layer semitransparent film is such that a semi-transparent film made of a chromium-based material and a semi-transparent film made of a molybdenum silicide-based material are sequentially provided on the transparent substrate.