COATING AND DEVELOPING METHOD AND COATING AND DEVELOPING APPARATUS

• US 20190332013A1
• Filed: 07/08/2019
• Published: 10/31/2019
• Est. Priority Date: 09/23/2016
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: KAWAKAMI, Shinichiro, MIZUNOURA, Hiroshi
• Granted Patent: US 10,732,508 B2
• Time in Patent Office: Days
• CPC Class Codes: B05D 1/005 Spin coating
• CPC Class Codes: B05D 1/32 using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
• CPC Class Codes: B05D 1/322 Removable films used as masks
• CPC Class Codes: B05D 1/36 Successively applying liquids or other fluent materials, e.g. without intermediate treatment
• CPC Class Codes: G03F 7/0043 Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof G03F7/0044 takes precedence
• CPC Class Codes: G03F 7/11 having cover layers or intermediate layers, e.g. subbing layers G03F7/091 - G03F7/093, B41N3/03 take precedence
• CPC Class Codes: G03F 7/16 Coating processes; Apparatus therefor applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74
• CPC Class Codes: G03F 7/162 Coating on a rotating support, e.g. using a whirler or a spinner
• CPC Class Codes: G03F 7/168 Finishing the coated layer, e.g. drying, baking, soaking
• CPC Class Codes: G03F 7/2002 with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
• CPC Class Codes: G03F 7/3021 from a wafer supported on a rotating chuck
• CPC Class Codes: G03F 7/3057 characterised by the processing units other than the developing unit, e.g. washing units
• CPC Class Codes: G03F 7/32 Liquid compositions therefor, e.g. developers
• CPC Class Codes: G03F 7/38 Treatment before imagewise removal, e.g. prebaking G03F7/265 takes precedence
• CPC Class Codes: G03F 7/70991 Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
• CPC Class Codes: H01L 21/0274 Photolithographic processes

Abstract

A coating and developing method includes: a step that applies a resist containing a metal to a front surface of a substrate to form a resist film, and exposes the resist film; a developing step that supplies a developer to the front surface of the substrate to develop the resist film; and a step that forms, before the developing step, a first protective film on a peripheral part of the substrate on which the resist film is not formed, so as to prevent the developer from coming into contact with the peripheral part of the substrate, wherein the first protective film is formed at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.

Claims

1. A coating and developing apparatus comprising:

a resist film forming module that applies a resist containing a metal to a front surface of a substrate to form a resist film;

a developing module that supplies a developer to the front surface of the substrate to develop the resist film having been exposed; and

a protective film forming module that forms a protective film on a peripheral part of the substrate on which the resist film is not formed, wherein the protective film prevents the developer from coming into contact with the peripheral part of the substrate, and wherein the protective film is formed at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.

2. A coating and developing apparatus comprising:

a resist film forming module that applies a resist containing a metal to a front surface of a substrate to form a resist film;

a developing module that supplies a developer to the front surface of the substrate to develop the resist film having been exposed; and

an adhesion prevention liquid supplying unit that supplies, during a time period from before the developer is supplied to the peripheral part of the substrate until the developer is removed from the front surface of the substrate, an adhesion prevention liquid for preventing adhesion of the metal along a circumference of the substrate to a peripheral part of the substrate on which the resist film is not formed, wherein the adhesion prevention liquid is supplied at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.