DEFECT PATTERN GROUPING METHOD AND SYSTEM

• US 20190333205A1
• Filed: 01/18/2018
• Published: 10/31/2019
• Est. Priority Date: 01/18/2017
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: FANG, Wei, ZHANG, Haili, CHEN, Zhichao, JIN, Shengcheng
• Granted Patent: US 11,238,579 B2
• Time in Patent Office: Days
• CPC Class Codes: G03F 7/7065 Defects, e.g. optical inspection of patterned layer for defects
• CPC Class Codes: G05B 19/406 characterised by monitoring or safety G05B19/19 takes precedence
• CPC Class Codes: G05B 2219/32222 Fault, defect detection of origin of fault, defect of product
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.

Claims

1. A defect pattern grouping method comprising,

obtaining a first polygon that represents a first defect from an image of a sample;

comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection; and

grouping the first polygon with any one or more representative polygons identified based on the comparison.

2. The defect pattern grouping method of claim 1, further comprising:

acquiring the set of one or more representative polygons having a polygon pattern that is similar to a pattern of the first polygon.

3. The defect pattern grouping method of claim 2, further comprising:

designating the first polygon and the acquired set of one or more representative polygons as central polygons.

4. The defect pattern grouping method of claim 2, further comprising:

comparing neighboring polygon information of the central polygons, and/or

wherein the neighboring polygon information includes topological characteristics of one or more neighboring polygon patterns surrounding the central polygons.

5. The defect pattern grouping method of claim 2, further comprising:

acquiring the set of one or more representative polygons having one or more topological characteristics that are similar to one or more topological characteristics of the first polygon.

6. The defect pattern grouping method of claim 2, wherein comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection further comprises determining a similarity between the first polygon and the set of one or more representative polygons of a defect-pattern collection.

7. The defect pattern grouping method of claim 6, wherein determining the similarity between the first polygon and the set of one or more representative polygons of a defect-pattern collection further comprises,

aligning the polygon pattern of the first defect with the polygon pattern of one of the set of one or more representative polygons of a defect-pattern collection;

and

determining the similarity based on the alignment.

8. The defect pattern grouping method of claim 7, further comprising,

grouping the first polygon with any one or more acquired representative polygons, in response to the similarity being greater than a preset similarity threshold.

9. The defect pattern grouping method of claim 7, further comprising,

grouping the first polygon as a representative polygon of a defect pattern, in response to the similarity not being greater than a preset similarity threshold.

10. A defect pattern grouping system comprising:

a memory configured to store a set of instructions; and

,

a processor configured to execute the set of instructions to cause the defect pattern grouping system to;

obtain a first polygon that represents a first defect from an image of a sample;

compare the first polygon with a set of one or more representative polygons of a defect-pattern collection; and

group the first polygon with any one or more representative polygons identified based on the comparison.

11. The defect pattern grouping system of claim 10, wherein the processor is configured to execute the set of instructions to further cause the defect pattern grouping system to:

acquire the set of one or more representative polygons having a polygon pattern that is similar to a pattern of the first polygon, and/or

wherein the processor is configured to execute the set of instructions to further cause the defect pattern grouping system to;

designate the first polygon and the acquired set of one or more representative polygons as central polygons.

12. The defect pattern grouping system of claim 11, wherein the processor is configured to execute the set of instructions to further cause the defect pattern grouping system to:

compare neighboring polygon information of the central polygons, and/or

wherein the neighboring polygon information includes topological characteristics of one or more neighboring polygon patterns surrounding the central polygons.

13. The defect pattern grouping system of claim 11, wherein the processor is configured to execute the set of instructions to further cause the defect pattern grouping system to:

acquire the set of one or more representative polygons having one or more topological characteristics that are similar to one or more topological characteristics of the first polygon.

14. The defect pattern grouping system of claim 11, wherein the comparison of the first polygon with a set of one or more representative polygons of a defect-pattern collection further comprises a determination of a similarity between the first polygon and the set of one or more representative polygons of a defect-pattern collection, and/or

wherein the determination of the similarity between the first polygon and the set of one or more representative polygons of a defect-pattern collection further comprises,

an alignment of the polygon pattern of the first defect with the polygon pattern of one of the set of one or more representative polygons of a defect-pattern collection;

and

a determination of the similarity based on the alignment.

15. The defect pattern grouping system of claim 14, wherein the processor is configured to execute the set of instructions to further cause the defect pattern grouping system to:

group the first polygon with any one or more acquired representative polygons, in response to the similarity being greater than a preset similarity threshold, and/or

wherein the processor is configured to execute the set of instructions to further cause the defect pattern grouping system to;

group the first polygon as a representative polygon of a defect pattern, in response to the similarity not being greater than a preset similarity threshold.