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Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

  • US 20190375053A1
  • Filed: 06/10/2019
  • Published: 12/12/2019
  • Est. Priority Date: 06/12/2018
  • Status: Active Grant
First Claim
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1. A Cu core ball comprising:

  • a Cu ball, anda solder layer for covering a surface of the Cu ball,wherein the Cu ball contains at least one element selected from a group of Fe, Ag and Ni in a total amount of 5.0 ppm by mass or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities,wherein the Cu ball contains purity which is 99.995% by mass or higher to 99.9995% by mass or lower, and sphericity which is 0.95 or higher, andwherein the solder layer includes Ag in an amount of more than 0% by mass to 4.0% by mass or less, Cu in an amount of more than 0% by mass to 3.0% by mass or less, and remainder of Sn.

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