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METHOD OF MANUFACTURING SiP MODULE BASED ON DOUBLE PLASTIC-SEALING AND THE SiP MODULE

  • US 20190385952A1
  • Filed: 12/03/2018
  • Published: 12/19/2019
  • Est. Priority Date: 06/14/2018
  • Status: Active Grant
First Claim
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1. A manufacturing method of a system in package (SiP) module based on double plastic-sealing, the manufacturing method comprising the steps of:

  • welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA);

    implementing a first-time filling to fill on plastic materials on a top surface of the PCBA, ensuring that the plastic materials cover the electronic units on the top surface of the PCBA, and obtaining a first-time plastic-sealing PCBA after the plastic materials are solidified;

    pasting tightly a functional film on a top surface of the first-time plastic-sealing PCBA to obtain a film-pasted PCBA; and

    implementing a second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover a top surface and a periphery of the film-pasted PCBA, and obtaining the SiP module after the plastic materials of the second-time filling are solidified.

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