METHOD OF MANUFACTURING SiP MODULE BASED ON DOUBLE PLASTIC-SEALING AND THE SiP MODULE

• US 20190385952A1
• Filed: 12/03/2018
• Published: 12/19/2019
• Est. Priority Date: 06/14/2018
• Status: Active Grant

• Current Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: LING, DONG-FENG, CAO, CHUN, ZOU, YUN-GANG
• Granted Patent: US 10,643,955 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

A manufacturing method of a system in package (SiP) module based on double plastic-sealing, including: welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA); implementing a first-time filling to fill on plastic materials on a top surface of the PCBA, ensuring that the plastic materials cover the electronic units, and obtaining a first-time plastic-sealing PCBA after the plastic materials are solidified; pasting tightly a functional film on a top surface of the first-time plastic-sealing PCBA to obtain a film-pasted PCBA; and implementing a second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover a top surface and a periphery of the film-pasted PCBA, and obtaining the SiP module after the plastic materials are solidified.

Claims

1. A manufacturing method of a system in package (SiP) module based on double plastic-sealing, the manufacturing method comprising the steps of:

welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA);

implementing a first-time filling to fill on plastic materials on a top surface of the PCBA, ensuring that the plastic materials cover the electronic units on the top surface of the PCBA, and obtaining a first-time plastic-sealing PCBA after the plastic materials are solidified;

pasting tightly a functional film on a top surface of the first-time plastic-sealing PCBA to obtain a film-pasted PCBA; and

implementing a second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover a top surface and a periphery of the film-pasted PCBA, and obtaining the SiP module after the plastic materials of the second-time filling are solidified.

2. The manufacturing method of the SiP module based on double plastic-sealing according to claim 1, wherein the functional film includes:

a plurality of film units being spaced apart from each other by cutting channels, wherein each of the cutting channels is connected to adjacent ones of the film units and is formed with a hollow portion, and wherein each of the film units corresponds to a respective one of the SiP modules.

3. The manufacturing method of the SiP module based on double plastic-sealing according to claim 1, wherein the step of pasting tightly the functional film on the top surface of the first-time plastic-sealing PCBA to obtain the film-pasted PCBA further includes:

pasting the functional film on the top surface of the first-time plastic-sealing PCBA; and

applying a top-down pressure onto the functional film to ensure that the functional film is pasted tightly on the top surface of the first-time plastic-sealing PCBA to obtain the film-pasted PCBA.

4. The manufacturing method of the SiP module based on double plastic-sealing according to claim 3, wherein applying a top-down pressure onto the functional film to ensure that the functional film is pasted tightly on the top surface of the first-time plastic-sealing PCBA to obtain the film-pasted PCBA further includes:

applying a top-down pressure onto the functional film; and

heating the first-time plastic-sealing PCBA until the plastic materials are solidified to ensure that the functional film is pasted tightly on the top surface of the first-time plastic-sealing PCBA so as to obtain the film-pasted PCBA.

5. The manufacturing method of the SiP module based on double plastic-sealing according to claim 1, wherein the step of implementing the second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover the top surface and the periphery of the film-pasted PCBA, and obtaining the SiP module after the plastic materials of the second-time filling are solidified further includes:

implementing the second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover the top surface and the periphery of the film-pasted PCBA, and obtaining a second-time plastic-sealing PCBA after the plastic materials of the second-time filling are solidified; and

cutting the second-time plastic-sealing PCBA so as to obtain a plurality of the SiP modules.

6. The manufacturing method of the SiP module based on double plastic-sealing according to claim 5, further comprising the step of:

configuring an electromagnetic shielding layer on a periphery and a top surface of the SiP module.

7. The manufacturing method of the SiP module based on double plastic-sealing according to claim 6, wherein the functional film includes:

a plurality of film units being spaced apart from each other by cutting channels, wherein each of the cutting channels has a portion connected to adjacent ones of the film units and is formed with a hollow portion, and wherein each of the film units corresponds to a respective one of the SiP modules.

8. The manufacturing method of the SiP module based on double plastic-sealing according to claim 7, wherein:

the cutting channels include horizontal cutting channels and vertical cutting channels; and

each of the horizontal cutting channels is formed with the hollow portion that is independent from each of the vertical cutting channels, each of the vertical cutting channels is formed with a hollow portion that is independent from each of the horizontal cutting channels, each of the horizontal cutting channels intersects with each of the vertical cutting channels to form the portion that is connected to adjacent ones of the film units.

9. A system in package (SiP) module, comprising:

a Printed Circuit Board (PCB) having a top surface with electronic units required by the SiP module provided on the top surface, and a bottom surface with reserved welding spots provided on the bottom surface;

a first plastic-sealing layer, with the electronic units covered therein;

a functional film pasted tightly on a top surface of the first plastic-sealing layer; and

a second plastic-sealing layer, covering the functional film and the first plastic-sealing layer.

10. The SiP module according to claim 9, wherein the functional film provided with electromagnetic shielding function.

11. The SiP module according to claim 9, further comprising:

an electromagnetic shielding layer covering a periphery and a top surface of the SiP module.