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SiP MODULE AND MANUFACTURING METHOD OF THE SiP MODULE

  • US 20190387610A1
  • Filed: 12/03/2018
  • Published: 12/19/2019
  • Est. Priority Date: 06/14/2018
  • Status: Active Grant
First Claim
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1. A manufacturing method of a system in package (SiP) module, comprising the steps of:

  • welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA) of the SiP module;

    pasting tightly a functional film on a surface of the electronic units of the PCBA;

    filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials cover the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and

    cutting the solidified PCBA to obtain a plurality of the SiP modules.

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