SiP MODULE AND MANUFACTURING METHOD OF THE SiP MODULE

• US 20190387610A1
• Filed: 12/03/2018
• Published: 12/19/2019
• Est. Priority Date: 06/14/2018
• Status: Active Grant

• Current Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: CAO, JING, MONG, WENG-KHOON, LING, DONG-FENG
• Granted Patent: US 10,798,814 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 2203/0759 Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
• CPC Class Codes: H05K 2203/1311 Foil encapsulation, e.g. of mounted components
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1322 Encapsulation comprising more than one layer
• CPC Class Codes: H05K 2203/1327 Moulding over PCB locally or completely
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/328 by welding
• CPC Class Codes: H05K 5/065 sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: H05K 9/0084 : comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Abstract

A method of manufacturing a System in Package (SiP) module includes: welding required electronic units by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB for obtaining a PCB assembly (PCBA) of the SiP module; pasting tightly a functional film on a surface of the electronic units of the PCBA; filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials covers the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and cutting the solidified PCBA for obtaining a plurality of the SiP modules.

Claims

1. A manufacturing method of a system in package (SiP) module, comprising the steps of:

welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA) of the SiP module;

pasting tightly a functional film on a surface of the electronic units of the PCBA;

filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials cover the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and

cutting the solidified PCBA to obtain a plurality of the SiP modules.

2. The manufacturing method according to claim 1, wherein the functional film includes:

a plurality of film units being spaced apart from each other by cutting channels, wherein each of the cutting channels is connected to adjacent ones of the film units and is formed with a hollow portion, and wherein each of the film units corresponds to a respective one of the SiP modules.

3. The manufacturing method according to claim 1, wherein the step of pasting tightly the functional film on the surface of the electronic units of the PCBA further includes:

pasting the functional film on the surface of the electronic units of the PCBA;

applying an external pressure onto the functional film; and

heating the PCBA to ensure that the functional film is pasted tightly on the surface of the electronic units of the PCBA.

4. The manufacturing method according to claim 1, wherein the step of pasting tightly the functional film on the surface of the electronic units of the PCBA further includes:

pasting the functional film on a top surface of the electronic units of the PCBA; and

applying a top-down pressure onto the functional film to ensure that the functional film is pasted tightly on the top surface of the electronic units of the PCBA.

5. The manufacturing method according to claim 4, wherein the step of applying the top-down pressure onto the functional film to ensure that the functional film is pasted tightly on the top surface of the electronic units of the PCBA further includes:

applying the top-down pressure onto the functional film; and

heating the PCBA until the plastic materials are solidified to ensure that the functional film is pasted tightly on the surface of the electronic units of the PCBA.

6. The manufacturing method according to claim 1, further comprising:

applying metal sputtering on a periphery and a top surface of the SiP module to form an electromagnetic shielding layer.

7. The manufacturing method according to claim 6, wherein the functional film includes:

a plurality of film units being spaced apart from each other by cutting channels, wherein each of the cutting channels has a portion connected to adjacent ones of the film units and is formed with a hollow portion, and wherein each of the film units corresponds to a respective one of the SiP modules.

8. The manufacturing method according to claim 7, wherein:

the cutting channels include horizontal cutting channels and vertical cutting channels; and

each of the horizontal cutting channels is formed with the hollow portion that is independent from each of the vertical cutting channels, each of the vertical cutting channels is formed with a hollow portion that is independent from each of the horizontal cutting channels, each of the horizontal cutting channels intersects with each of the vertical cutting channels to form the portion that is connected to adjacent ones of the film units.

9. A system in package (SiP) module, comprising:

a Printed Circuit Board (PCB) having a top surface with electronic units required by the SiP module provided on the top surface, and a bottom surface with reserved welding spots provided one the bottom surface; and

a functional film pasted tightly on a surface of the electronic units, wherein the functional film and the electronic units are covered by plastic materials.

10. The SiP module according to claim 9, wherein the functional film possesses electromagnetic shielding function.

11. The SiP module according to claim 9, wherein a periphery and a top surface of the plastic materials are configured with an electromagnetic shielding layer.