Contacting Embedded Electronic Component Via Wiring Structure in a Component Carrier's Surface Portion With Homogeneous Ablation Properties
First Claim
1. A component carrier for carrying electronic components, wherein the component carrier comprises:
- an at least partially electrically insulating core;
at least one electronic component embedded in the core;
a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end;
wherein the at least one electronic component is electrically contacted directly to the component contacting end;
wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure;
wherein the wiring contacting end is electrically contacted directly to the wiring structure; and
wherein the at least one electrically conductive through-connection comprises at least one pillar.
1 Assignment
0 Petitions
Accused Products
Abstract
A component carrier for carrying electronic components includes an at least partially electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The at least one electronic component is electrically contacted directly to the component contacting end. At least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure, and the wiring contacting end is electrically contacted directly to the wiring structure.
6 Citations
20 Claims
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1. A component carrier for carrying electronic components, wherein the component carrier comprises:
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an at least partially electrically insulating core; at least one electronic component embedded in the core; a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end; wherein the at least one electronic component is electrically contacted directly to the component contacting end; wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure; wherein the wiring contacting end is electrically contacted directly to the wiring structure; and wherein the at least one electrically conductive through-connection comprises at least one pillar. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of manufacturing a component carrier for carrying electronic components, comprising:
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embedding at least one electronic component in an at least partially electrically insulating core; providing a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and being formed with a component contacting end and a wiring contacting end, wherein the at least one electrically conductive through-connection comprises at least one pillar; electrically contacting the at least one electronic component directly to the component contacting end; providing at least an exterior surface portion of the coupling structure with homogeneous ablation properties; patterning the exterior surface portion so as to form surface recesses; and filling the surface recesses with an electrically conductive wiring structure so that the wiring contacting end is electrically contacted directly to the wiring structure. - View Dependent Claims (20)
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Specification