METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

• US 20200130109A1
• Filed: 01/18/2018
• Published: 04/30/2020
• Est. Priority Date: 03/15/2017
• Status: Active Grant

• Current Assignee: Resonac Corp. (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: KAWANA, Yuki, NAKAKO, Hideo, NEGISHI, Motohiro, ISHIKAWA, Dai, SUGAMA, Chie, EJIRI, Yoshinori
• Granted Patent: US 11,370,066 B2
• Time in Patent Office: Days
• CPC Class Codes: B22F 1/05 Metallic powder characterised by the size or surface area of the particles
• CPC Class Codes: B22F 1/052 characterised by a mixture of particles of different sizes or by the particle size distribution
• CPC Class Codes: B22F 1/068 Flake-like particles
• CPC Class Codes: B22F 1/10 Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
• CPC Class Codes: B22F 2301/10 Copper
• CPC Class Codes: B22F 2304/058 Particle size above 300 nm up to 1 micrometer
• CPC Class Codes: B22F 2999/00 Aspects linked to processes or compositions used in powder metallurgy
• CPC Class Codes: B22F 3/10 Sintering only
• CPC Class Codes: B22F 3/22 for producing castings from a slip
• CPC Class Codes: B22F 7/064 using an intermediate powder layer
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/20 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 35/025 Pastes, creams, slurries
• CPC Class Codes: B23K 35/302 Cu as the principal constituent
• CPC Class Codes: B23K 35/3618 Carboxylic acids or salts
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/40245 the item being metallic
• CPC Class Codes: H01L 2224/40491 being an additional member attached to the bonding area through an adhesive or solder, e.g. buffer pad
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48175 : the item being metallic
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73221 : Strap and wire connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49562 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49582 : Metallic layers on lead frames
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 ηm, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.

Claims

1. A metal paste for joints, comprising:

metal particles; and

a monovalent carboxylic acid having 1 to 9 carbon atoms,

wherein the metal particles comprise sub-micro copper particles having a volume average particle diameter of 0.12 μ

m to 0.8 μ

m, and

a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.

2. The metal paste for joints according to claim 1, further comprising:

a carboxylic acid having carbon atoms of greater than or equal to 10,

wherein a content of the carboxylic acid having carbon atoms of greater than or equal to 10 is 0.07 part by mass to 2.10 parts by mass with respect to 100 parts by mass of the metal particles.

3. The metal paste for joints according to claim 1,

wherein the metal particles further comprise flake-shaped micro copper particles having a maximum diameter of 2 μ

m to 50 μ

m and an aspect ratio of greater than or equal to 3.0,

a content of the sub-micro copper particles is 30 mass % to 90 mass % on the basis of a total mass of the metal particles, and

a content of the micro copper particles is 10 mass % to 70 mass % on the basis of the total mass of the metal particles.

4. The metal paste for joints according to claim 1,

wherein the metal particles further comprise at least one type of metal particles selected from the group consisting of zinc and silver at a content of 0.01 mass % to 10 mass % on the basis of the total mass of the metal particles.

5. The metal paste for joints according to claim 1,

wherein the monovalent carboxylic acid having 1 to 9 carbon atoms comprises at least one type selected from the group consisting of an acetic acid, a hexanoic acid, and a butyric acid.

6. The metal paste for joints according to claim 1, comprising:

a solvent component at a content of 2 mass % to 50 mass % on the basis of a total mass of the metal paste.

7. The metal paste for joints according to claim 6,

wherein the solvent component comprise a solvent component having a boiling point of higher than or equal to 300°

C., and

a content of the solvent component having a boiling point of higher than or equal to 300°

C. is 2 mass % to 50 mass % on the basis of the total mass of the metal paste.

8. The metal paste for joints according to claim 7,

wherein the solvent component having a boiling point of higher than or equal to 300°

C. comprises at least one type selected from the group consisting of isobornyl cyclohexanol, tributyrin, butyl stearate, and octyl octanoate.

9. A production method for an assembly, the method comprising:

a step of preparing a laminated body in which a first member, the metal paste for joints according to claim 1, and a second member are laminated in this order, and of sintering the metal paste for joints at a temperature of lower than or equal to 250°

C. in a state of receiving self-weight of the first member or in a state or receiving the self-weight of the first member and a pressure of less than or equal to 0.01 MPa.

10. A production method for a semiconductor device, the method comprising:

a step of preparing a laminated body in which a first member, the metal paste for joints according to claim 1, and a second member are laminated in this order, and of sintering the metal paste for joints at a temperature of lower than or equal to 250°

C. in a state of receiving self-weight of the first member or in a state of receiving the self-weight of the first member and a pressure of less than or equal to 0.01 MPa,

wherein at least one of the first member and the second member is a semiconductor element.

11. An assembly comprising:

a first member;

a second member;

a sintered body of the metal paste for joints according to claim 1, the sintered body joining the first member and the second member together.

12. The assembly according to claim 11,

wherein at least one of the first member and the second member comprises at least one type of metal selected from the group consisting of copper, nickel, silver, gold, and palladium, on a surface in contact with the sintered body.

13. A semiconductor device, comprising:

a first member;

a second member; and

a sintered body of the metal paste for joints according to claim 1, the sintered body joining the first member and the second member together,

wherein at least one of the first member and the second member is a semiconductor element.