METHOD OF MANUFACTURING COMPOSITE ARTICLE

• US 20200130137A1
• Filed: 02/26/2019
• Published: 04/30/2020
• Est. Priority Date: 10/31/2018
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: CHIANG, HUA-CHOU, SEE, CHANDLER YING LAI, KO, CHUNG-CHIEH
• Granted Patent: US 11,911,871 B2
• Time in Patent Office: Days
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B27N 3/007 and at least partly composed of recycled material
• CPC Class Codes: H01L 21/304 Mechanical treatment, e.g. grinding, polishing, cutting H01L21/30625 takes precedence
• CPC Class Codes: H01L 21/3212 by chemical mechanical polishing [CMP]
• CPC Class Codes: H01L 21/67 Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto H01L24/74;
• CPC Class Codes: Y02P 80/30 Reducing waste in manufacturing processes; Calculations of released waste quantities

Abstract

A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.

Claims

1. A method of manufacturing a composite article, comprising:

rubbing a polishing pad to remove a portion of the polishing pad to produce polishing pad debris;

collecting the polishing pad debris;

providing a wood material; and

applying a force over the wood material and the polishing pad debris to form the composite article,

wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.

2. The method of claim 1, wherein the rubbing of the polishing pad includes grinding a semiconductor structure by the polishing pad.

3. The method of claim 2, wherein the semiconductor structure is a substrate or a wafer.

4. The method of claim 1, wherein the polishing pad and the polishing pad debris include polyurethane (PU).

5. The method of claim 1, wherein a thickness of the polishing pad is reduced by the rubbing of the polishing pad.

6. The method of claim 1, wherein a first content of the polishing pad debris in the composite article is less than a second content of the wood material in the composite article.

7. The method of claim 6, wherein a ratio of the first content to the second content is about 3:

7.

8. The method of claim 1, wherein the application of the force includes compressing the wood material and the polishing pad debris to form the composite article.

9. The method of claim 1, further comprising assembling the composite article with a plurality of wooden bars to form a pallet.

10. The method of claim 1, wherein the composite article is in a block configuration.

11. A method of manufacturing a composite article, comprising:

providing a polishing pad including a rough surface;

providing a semiconductor structure disposed above the polishing pad;

contacting the semiconductor structure with the rough surface of the polishing pad;

rotating the semiconductor structure relative to the polishing pad;

providing a wood material; and

compressing the wood material and a debris produced upon the rotation of the semiconductor structure to form the composite article,

wherein the debris includes a portion of the polishing pad removed from the polishing pad upon the rotation of the semiconductor structure.

12. The method of claim 11, wherein the rough surface of the polishing pad is in contact with the semiconductor structure upon the rotation of the semiconductor structure.

13. The method of claim 11, wherein the polishing pad includes a plurality of protrusions protruded from the rough surface of the polishing pad, and a height of one of the plurality of protrusions is reduced by the rotation of the semiconductor structure.

14. The method of claim 11, further comprising:

prior to the compression of the wood material and the debris, cleaning the debris to remove a portion of the semiconductor structure debris from the debris, wherein the portion of the semiconductor structure debris is generated from the semiconductor structure upon the rotation of the semiconductor structure.

15. The method of claim 11, further comprising applying a force over the semiconductor structure towards the polishing pad upon the rotation of the semiconductor structure.

16. The method of claim 11, further comprising rotating the polishing pad relative to the semiconductor structure.

17. The method of claim 16, wherein the rotation of the polishing pad and the rotation of the semiconductor structure are performed separately or simultaneously.

18. A method of manufacturing a composite article, comprising:

providing a polishing pad;

providing a semiconductor structure disposed above the polishing pad;

polishing the semiconductor structure by the polishing pad;

collecting a polishing pad debris produced upon the polishing;

providing a wood material; and

compressing the wood material and the polishing pad debris to form the composite article,

wherein the polishing pad debris includes a portion of the polishing pad removed from the polishing pad upon the polishing.

19. The method of claim 18, wherein the polishing pad debris is cleaned prior to the compression.

20. The method of claim 18, further comprising:

providing a plurality of wooden bars arranged substantially in parallel to each other;

attaching the composite article to an end of one of the plurality of wooden bars.