RESIN COMPOSITION, RESIN SHEET, LAMINATE, AND SEMICONDUCTOR ELEMENT

• US 20200131365A1
• Filed: 08/31/2017
• Published: 04/30/2020
• Est. Priority Date: 03/13/2017
• Status: Active Grant

• Current Assignee: Lintec Corporation
• Original Assignee: Lintec Corporation
• Inventors: KARASAWA, Yasunori
• Granted Patent: US 11,512,200 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2255/12 on paper layer
• CPC Class Codes: B32B 2255/26 Polymeric coating
• CPC Class Codes: B32B 2307/732 Dimensional properties
• CPC Class Codes: B32B 2307/748 Releasability
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/10 of paper or cardboard
• CPC Class Codes: B32B 27/281 comprising polyimides
• CPC Class Codes: B32B 27/285 comprising polyethers
• CPC Class Codes: B32B 27/32 comprising polyolefins comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: B32B 29/005 next to another layer of paper or cardboard layer
• CPC Class Codes: B32B 7/06 permitting easy separation
• CPC Class Codes: C08K 2003/2227 of aluminium
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08L 101/00 Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 25/02 Homopolymers or copolymers of hydrocarbons
• CPC Class Codes: C08L 61/12 with polyhydric phenols
• CPC Class Codes: C08L 61/14 Modified phenol-aldehyde condensates
• CPC Class Codes: C08L 71/12 : Polyphenylene oxides
• CPC Class Codes: C08L 79/08 : Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08L 79/085 : Unsaturated polyimide precursors
• CPC Class Codes: H01L 23/293 : Organic, e.g. plastic
• CPC Class Codes: H01L 23/295 : containing a filler H01L23/296 takes precedence

Abstract

A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

Claims

1. A resin composition comprising:

a (A) thermoplastic component;

a (B) thermosetting component; and

a (C) inorganic filler, wherein

a 5%-weight-reduction temperature of a hardened substance of the resin composition is 440 degrees C. or more.

2. The resin composition according to claim 1, wherein

the (B) thermosetting component comprises a bismaleimide resin.

3. The resin composition according to claim 2, wherein

the (B) thermosetting component further comprises an allyl resin.

4. The resin composition according to claim 1, wherein

the (A) thermoplastic component comprises a phenoxy resin.

8. A resin sheet made of the resin composition according to claim 1.

9. A resin sheet made of the resin composition according to claim 1, wherein

the (B) thermosetting component in the resin composition comprises a bismaleimide resin.

10. A resin sheet made of the resin composition according to claim 1, wherein

the (B) thermosetting component in the resin composition comprises a bismaleimide resin and an allyl resin.

11. The resin sheet according to claim 8, wherein

the (A) thermoplastic component comprises a phenoxy resin.

15. A laminate comprising:

the resin sheet according to claim 8; and

a release material, wherein

the release material comprises a releasing agent layer made of an alkyd resin releasing agent.

19. A semiconductor device produced with a use of the resin composition according to claim 1.

20. A semiconductor device produced with a use of the resin sheet according to claim 8.

21. A semiconductor device produced with a use of the resin composition according to claim 1 and at least one of silicon carbide or gallium nitride.

22. A semiconductor device produced with a use of the resin sheet according to claim 8 and at least one of silicon carbide or gallium nitride.

5-7. -7. (canceled)

12-14. -14. (canceled)

16-18. -18. (canceled)