RADIATION CURABLE ORGANOSILICON RESIN COMPOSITION

• US 20200131367A1
• Filed: 10/30/2019
• Published: 04/30/2020
• Est. Priority Date: 10/31/2018
• Status: Active Grant

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: IGUCHI, Hiroyuki, KASHIWAGI, Tsutomu
• Granted Patent: US 11,326,056 B2
• Time in Patent Office: Days
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08G 77/24 halogen-containing groups
• CPC Class Codes: C08G 77/38 Polysiloxanes modified by chemical after-treatment C08G77/045 takes precedence
• CPC Class Codes: C08J 3/28 Treatment by wave energy or particle radiation
• CPC Class Codes: C08K 2201/011 Nanostructured additives
• CPC Class Codes: C08K 3/013 Fillers, pigments or reinforcing additives
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08K 5/10 Esters; Ether-esters
• CPC Class Codes: C08K 5/103 with polyalcohols
• CPC Class Codes: C08K 5/132 Phenols containing keto groups , e.g. benzophenones
• CPC Class Codes: C08K 5/5415 containing at least one Si—O bond
• CPC Class Codes: C08L 2201/14 Gas barrier composition
• CPC Class Codes: C08L 2203/20 use in electrical or conductive gadgets
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: C08L 83/06 containing silicon bound to oxygen-containing groups C08L83/12 takes precedence
• CPC Class Codes: C08L 83/08 containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
• CPC Class Codes: C09D 183/06 containing silicon bound to oxygen-containing groups C09D183/12 takes precedence
• CPC Class Codes: G03F 7/0047 characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: G03F 7/0755 Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds G03F7/0752 takes precedence

Abstract

One of the purposes of the present invention is to provide a radiation curable organosilicon resin composition which offers a cured product having a sufficient gas barrier property and which further has workability enough for use in spin coating or inkjetting. The present invention provides a radiation curable organosilicon resin composition comprising 100 parts by mass of (A) a (meth)acryloyloxy group-containing organosilane represented by the formula (1) which has a (meth)acryloyloxy group or a monovalent organic group having 4 to 25 carbon atoms and having one, two, or three of said (meth)acryloyloxy group, and 1 to 50 parts by mass of (B) a photopolymerization initiator.

Claims

1. A radiation curable organosilicon resin composition comprisingparts by mass of (A) a compound represented by the following formula (1):

2. The radiation curable organosilicon resin composition according to claim 1, X is said (meth)acryloyloxy group or an organic group represented by the following formula,

3. The radiation curable organosilicon resin composition according to claim 2, wherein R³ is a hydrogen atom, an alkoxy group having 1 to 3 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an alkyl group having 1 to 3 carbon atoms, or an aryl group having 6 to 10 carbon atoms.

4. The radiation curable organosilicon resin composition according to claim 2 or 3, wherein Q is a single bond or an alkylene group having 1 to 3 carbon atoms.

5. The radiation curable organosilicon resin composition according to claim 2, wherein a is an integer of from 2 or 3.

6. The radiation curable organosilicon resin composition according to claim 1, having a dynamic viscosity at 25 degrees C. of from 1 to 2,000 mm²/s as determined according to the Japanese Industrial Standards(JIS) Z 8803:

2011.

7. The radiation curable organosilicon resin composition according to claim 1, wherein component (B) is a photopolymerization initiator at least having any one kind selected from a nitrogen atom, a sulfur atom and a phosphorus atom.

8. The radiation curable organosilicon resin composition according to claim 1, wherein the amount of component (B) is 10 to 30 parts by mass.

9. The radiation curable organosilicon resin composition according to claim 1, further comprising 0.5 to 10 parts by mass of (C) an alkoxysilane represented by the following formula (3) and/or a partial hydrolysis condensate thereof,

H₄₋

nSi(OR⁴)_n 

 

(3)

wherein R⁴ is a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms and n is an integer of 3 or 4.

10. The radiation curable organosilicon resin composition according to claim 1, wherein at least one of R¹ in the formula (1) is selected from a phenyl group, a naphthyl group, and a biphenyl group.

11. The radiation curable organosilicon resin composition according to claim 1, further comprising 3 to 30 parts by mass of (D) nanoparticles.

12. The radiation curable organosilicon resin composition according to claim 11, wherein component (D) is a quantum dot material.