STAGE DEVICE AND PROCESSING APPARATUS

• US 20200131625A1
• Filed: 10/22/2019
• Published: 04/30/2020
• Est. Priority Date: 10/25/2018
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: NAKAGAWASAI, Manabu, SUZUKI, Naoyuki, ORIMOTO, Shinji
• Granted Patent: US 11,293,092 B2
• Time in Patent Office: Days
• CPC Class Codes: C23C 14/34 Sputtering
• CPC Class Codes: C23C 14/505 for rotation of the substrates
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: C23C 16/4586 Elements in the interior of the support, e.g. electrodes, heating or cooling devices
• CPC Class Codes: H01F 41/183 Sputtering targets therefor

Abstract

A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a chiller having a cold head maintained at an extremely low temperature and a cold heat transfer body fixed in contact with the cold head and disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body. The stage device further includes a heat insulating structure unit having a vacuum insulated structure and configured to surround at least the cold head and a connection portion between the cold head and the cold heat transfer body, cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage, and a stage support rotated by a driving mechanism and configured to rotatably support the stage.

Claims

1. A stage device comprising:

a stage configured to hold a target substrate in a vacuum chamber;

a chiller having a cold head maintained at an extremely low temperature;

a cold heat transfer body fixed in contact with the cold head and disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body;

a heat insulating structure unit having a vacuum insulated structure and configured to surround at least the cold head and a connection portion between the cold head and the cold heat transfer body;

cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage; and

a stage support rotated by a driving mechanism and configured to rotatably support the stage.

2. The stage device of claim 1, wherein the heat insulating structure unit has a double-walled vacuum pipe structure including an inner pipe and an outer pipe, wherein an inner space between the inner pipe and the outer pipe is maintained in a vacuum state.

3. The stage device of claim 2, wherein the double-walled vacuum pipe structure has a bellows disposed at least at the inner pipe.

4. The stage device of claim 3, wherein the double-walled vacuum pipe structure has the bellows disposed at the inner pipe and the outer pipe.

5. The stage device of claim 4, wherein one of the bellows disposed at the inner pipe and the outer pipe is disposed at one end of the double-walled vacuum pipe structure, and the other bellows is disposed at the other end of the double-walled vacuum pipe structure.

6. The stage device of claim 2, wherein the heat insulating structure unit has a radiant heat shield at an inner side of the double-walled vacuum pipe structure.

7. The stage device of claim 2, further comprising a vacuum-evacuable pipeline connected to the inner space and a pressure gauge and a valve connected to the pipeline, wherein the inner space is evacuated through the pipeline when a vacuum level in the inner space is reduced.

8. The stage device of claim 2, wherein the heat insulating structure unit includes a first heat insulating body having a double-walled vacuum pipe structure disposed to surround the cold head and the connection portion between the cold head and the cold heat transfer body, and a second heat insulating body having a double-walled vacuum pipe structure disposed to surround substantially the entire cold heat transfer body.

9. The stage device of claim 8, wherein the second heat insulating body is disposed to surround a connection portion between the cold heat transfer body and the stage.

10. The stage device of claim 1, wherein the stage support is rotated via a rotating part that is rotated by a driving mechanism while being sealed with magnetic fluid.

11. The stage device of claim 2, wherein the stage includes an electrostatic chuck configured to attract and hold the target substrate.

12. The stage device of claim 11, wherein the cooling fluid supplied to the gap is a first cooling gas, and the first cooling gas is supplied to the gap through a first cooling gas channel formed in the cold heat transfer body.

13. The stage device of claim 12, wherein a second cooling gas for heat transfer is supplied to a gap between the target substrate and the electrostatic chuck through a second cooling gas channel different from the first cooling gas channel.

14. The stage device of claim 12, wherein the first cooling gas is supplied to a gap between the target substrate and the electrostatic chuck through a gas channel communicating with the first cooling gas channel.

15. The stage device of claim 12, wherein a space is formed between the stage support and the double-walled vacuum pipe structure of the heat insulating structure unit and the first cooling gas leaked from the gap flows into the space, the space being sealed with a sealing member, and

a gas channel is connected to the space to discharge the first cooling gas in the space or supply a second cooling gas as counterflow to the first cooling gas into the space.

16. The stage device of claim 1, wherein the stage support has a vacuum insulated structure.

17. The stage device of claim 1, wherein a connection portion between the stage and the cold heat transfer body has a comb-teeth shaped portion such that the gap between the stage and the cold heat transfer body has a concave-convex pattern.

18. A processing apparatus comprising:

a vacuum chamber;

a stage device configured to rotatably support a target substrate in the vacuum chamber, the stage devic comprising;

a stage configured to hold the target substrate in a vacuum chamber,

a chiller having a cold head maintained at an extremely low temperature,

a cold heat transfer body fixed in contact with the cold head and disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body,

a heat insulating structure unit having a vacuum insulated structure and configured to surround at least the cold head and a connection portion between the cold head and the cold heat transfer body,

cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage, and

a stage support rotated by a driving mechanism and configured to rotatably support the stage; and

a processing mechanism configured to process the target substrate in the vacuum chamber.

19. The processing apparatus of claim 18, wherein the processing mechanism includes a target for sputtering film formation, the target being disposed above the stage in the vacuum chamber.

20. The processing apparatus of claim 19, wherein the target is made of a material forming a magnetic film used for a tunneling magneto-resistance element.