Spatial Wafer Processing With Improved Temperature Uniformity
First Claim
1. A processing chamber comprising:
- a first processing station comprising a first gas injector having a first face, a first emissivity and a first temperature;
a second processing station comprising a second gas injector having a second face, a second emissivity and a second temperature; and
a substrate support assembly comprising a plurality of substantially coplanar support surfaces, the substrate support assembly configured to move the support surfaces between the first processing station and the second processing station,wherein the first face is spaced a first distance from the plurality of substantially coplanar support surfaces and the second face is spaced a second distance from the plurality of substantially coplanar support surfaces, and the first emissivity is lower than the second emissivity and/or the first temperature is greater than the second temperature.
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Accused Products
Abstract
Apparatus and methods to process one or more wafers are described. A processing chamber comprises a first processing station comprising a first gas injector having a first face, a first emissivity and a first temperature, a second processing station comprising a second gas injector having a second face, a second emissivity and a second temperature, and a substrate support assembly comprising a plurality of substantially coplanar support surfaces, the substrate support assembly configured to move the support surfaces between the first processing station and the second processing station. When a wafer is on the support surfaces, a temperature skew of less than about 0.5° C. is developed upon moving the wafer between the stations in about 0.5 seconds.
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Citations
20 Claims
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1. A processing chamber comprising:
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a first processing station comprising a first gas injector having a first face, a first emissivity and a first temperature; a second processing station comprising a second gas injector having a second face, a second emissivity and a second temperature; and a substrate support assembly comprising a plurality of substantially coplanar support surfaces, the substrate support assembly configured to move the support surfaces between the first processing station and the second processing station, wherein the first face is spaced a first distance from the plurality of substantially coplanar support surfaces and the second face is spaced a second distance from the plurality of substantially coplanar support surfaces, and the first emissivity is lower than the second emissivity and/or the first temperature is greater than the second temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A processing method comprising:
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moving a substrate support surface between a first processing station and a second processing station, the first processing station comprising a first gas injector having a first face spaced a first distance from the substrate support surface, a first emissivity and a first temperature, the second processing station comprising a second gas injector having a second face spaced a second distance from the substrate support surface, a second emissivity and a second temperature, wherein the first emissivity is lower than the second emissivity and/or the first temperature is greater than the second temperature. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A processing chamber comprising:
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a thermal processing station comprising a thermal showerhead having a first face, a first emissivity and a first temperature; a plasma processing station comprising a plasma showerhead having a second face, a second emissivity and a second temperature; a substrate support assembly comprising a plurality of substantially coplanar support surfaces having at least one wafer thereon, the substrate support assembly configured to move the at least one wafer between the thermal processing station and the plasma processing station; and a controller connected to the plurality of substantially coplanar support surfaces, wherein the first face is spaced in a range of about 0.5 mm to about 3 mm from the at least one wafer and the second face is spaced in a range of about 7 mm to about 15 mm from the at least one wafer, and the first emissivity is lower than the second emissivity and/or the first temperature is greater than the second temperature. - View Dependent Claims (19, 20)
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Specification