PROCEDURE FOR THE MANUFACTURING OF NANOSTRUCTURED PLATINUM

• US 20200131655A1
• Filed: 12/24/2019
• Published: 04/30/2020
• Est. Priority Date: 06/27/2017
• Status: Active Application

• Current Assignee: Albert-Ludwigs-Universitã¤T Freiburg
• Original Assignee: Albert-Ludwigs-Universitã¤T Freiburg
• Inventors: BOHLER, Christian, ASPLUND, Maria
• Application Number:
  US16/726,708
• Publication Number:
  US 20200131655A1
• Time in Patent Office: Days
• CPC Class Codes: C25D 3/50 of platinum group metals
• CPC Class Codes: C25D 5/617 Crystalline layers

Abstract

A method for the manufacturing of platinum nanostructures showing improved properties and usable in biomedical appliances is provided. The method includes providing a solution containing hexachloroplatinate with the remainder being water and electrochemical deposition of platinum on a substrate with the platinum deposited in a nanostructured form.

Claims

1. A method for the manufacturing of nanostructured platinum, the method comprising:

providing a solution containing hexachloroplatinate with the remainder water; and

electrochemically depositing platinum on a substrate, wherein the platinum is deposited in a nanostructured form.

2. The method according to claim 1, wherein the solution comprises a pH-value between approximately 1.5 and approximately 4.4.

3. The method according to claim 1, wherein a concentration of hexachloroplatinate is between approximately 0.2 mM and approximately 3.1 mM.

4. The method according to claim 1, wherein the electrochemical deposition is carried out in a voltage range between approximately −

0.4 V and approximately +0.4 V vs. Ag/AgCl.

5. The method according to claim 1, wherein the electrochemical deposition is carried out as a dynamic potential deposition.

6. The method according to claim 5, wherein the electrochemical deposition is carried out by a single sweep.

7. The method according to claim 5, wherein the electrochemical deposition is carried out by multiple sweeps in a given potential range.

8. The method according to claim 1, wherein a grain size of the deposited platinum is in a range between approximately 1 nm to approximately 500 nm.

9. The method according to claim 1, wherein a grain size of the deposited platinum is in a range between approximately 5 nm to approximately 400 nm.

10. The method according to claim 1, wherein a grain size of the deposited platinum is in a range between approximately 10 nm to approximately 200 nm

11. The method according to claim 1, wherein the electrochemical deposition of the platinum on the substrate comprises a dynamic potential process with multiple sweeps in a potential range between approximately 1 mV/s and approximately 200 mV/s.

12. The method according to claim 11, wherein the potential range is between approximately 2 mV/s and approximately 150 mV/s.

13. The method according to claim 1, wherein the electrochemical deposition of the platinum on the substrate comprises a total charge transferred between approximately 0.5 C/cm² and approximately 5 C/cm².

14. The method according to claim 1, wherein the electrochemical deposition of the platinum on the substrate comprises a total charge transferred between approximately 0.8 C/cm² and approximately 4 C/cm².

15. A method for the manufacturing of nanostructured platinum, the method comprising:

preparing a solution containing between approximately 0.2 mM and approximately 3.1 mM hexachloroplatinate with the remainder being water, wherein the pH-value of the solution is between approximately 1.5 and approximately 4.4;

placing a substrate in the solution; and

electrochemically depositing platinum on the substrate using dynamic potential deposition in a voltage range between approximately −

0.4 V and approximately +0.4 V vs. Ag/AgCl, wherein the deposited platinum comprises a grain size between approximately 5 nm to approximately 400 nm.

16. The method according to claim 15, wherein electrochemically depositing the platinum on the substrate comprises multiple sweeps in a potential range between approximately 1 mV/s and approximately 200 mV/s.

17. The method according to claim 15, wherein electrochemically depositing the platinum on the substrate comprises a total charge transferred between approximately 0.5 C/cm² and approximately 5 C/cm².

18. The method according to claim 15, wherein electrochemically depositing the platinum on the substrate comprises a deposition time between approximately 1 s and approximately 60 min.

19. A method for the manufacturing of nanostructured platinum, the method comprising:

preparing a solution containing between approximately 0.2 mM and approximately 3.1 mM hexachloroplatinate with the remainder being water, wherein the pH-value of the solution is between approximately 1.5 and approximately 4.4; and

electrochemically depositing platinum on a substrate using dynamic potential deposition in a voltage range between approximately −

0.4 V and approximately +0.4 V vs. Ag/AgCl and a deposition time between approximately 10 s and approximately 360 s, wherein the deposited platinum comprises a grain size between approximately 10 nm to approximately 200 nm.

20. The method according to claim 19, wherein electrochemically depositing the platinum on the substrate comprises multiple sweeps in a potential range between approximately 1 mV/s and approximately 200 mV/s.