COOLING DEVICE

• US 20200132388A1
• Filed: 11/21/2018
• Published: 04/30/2020
• Est. Priority Date: 10/26/2018
• Status: Abandoned Application

• Current Assignee: Inventec Corporation, Inventec Technology Company Limited (Inventec Corporation)
• Original Assignee: Inventec Technology Company Limited (Inventec Corporation)
• Inventors: CHENG, Tsai-Kuei, CHEN, Hung-Ju
• Application Number:
  US16/198,551
• Publication Number:
  US 20200132388A1
• Time in Patent Office: Days
• CPC Class Codes: F28D 15/025 having non-capillary condensate return means
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 2021/0028 for cooling heat generating elements, e.g. for cooling electronic components or electric devices for cooling semiconductors H01L23/34, for cooling electric apparatus H05K7/20
• CPC Class Codes: H05K 7/203 by immersion
• CPC Class Codes: H05K 7/20809 within server blades for removing heat from heat source

Abstract

A cooling device is configured to cool a heat source. The cooling device includes a tank, a cover and a cooling liquid. The tank includes a bottom surface, a tank inlet and a tank outlet. The cover is disposed on the tank. The cover and the tank form a space therebetween, and the space is configured to accommodate the heat source. The cooling liquid is located in the space.

Claims

1. A cooling device, configured to cool a heat source, comprising:

a tank, including a bottom surface, a tank inlet and a tank outlet;

a cover, disposed on the tank, the cover and the tank forming a space therebetween, and the space configured to accommodate the heat source; and

a cooling liquid, located in the space.

2. The cooling device according to claim 1, wherein the tank inlet of the tank is closer to the bottom surface of the tank than the tank outlet.

3. The cooling device according to claim 2, further comprising a liquid channel and a vapor channel, the liquid channel connected to the tank via the tank inlet, and the vapor channel connected to the tank via the tank outlet.

4. The cooling device according to claim 3, wherein the vapor channel includes an inlet end and an outlet end, the inlet end is connected to the tank outlet of the tank, and the inlet end is closer to the bottom surface of the tank than the outlet end.

5. The cooling device according to claim 4, wherein the cover includes a first side and a second side, the first side is closer to the tank outlet of the tank than the second side, and the first side is farther away from the bottom surface of the tank than the second side.

6. The cooling device according to claim 3, further comprising a heat exchange portion, wherein the vapor channel is connected to the liquid channel via the heat exchange portion.

7. The cooling device according to claim 6, further comprising a heat dissipation device connected to the heat exchange portion.

8. The cooling device according to claim 1, further comprising an electrical connector connected to the cover, wherein the electrical connector is configured to be electrically connected to the heat source.

9. The cooling device according to claim 1, further comprising a liquid pump device connected to the tank.

10. The cooling device according to claim 1, further comprising an air pump device connected to the tank.