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BONDING DEVICE AND METHOD FOR DETECTING HEIGHT OF SUBJECT

  • US 20200132438A1
  • Filed: 07/27/2017
  • Published: 04/30/2020
  • Est. Priority Date: 11/24/2016
  • Status: Active Grant
First Claim
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1. A bonding apparatus comprising:

  • an optical system that forms an image of a bonding target having a predetermined pattern;

    an imaging element that acquires the image formed by the optical system as a picture;

    an illumination unit that includes a plurality of light sources and illuminates the bonding target through an optical path of the optical system; and

    a control part that processes the image acquired by the imaging element,wherein the control part illuminates the bonding target through a first optical path of the optical system facing the bonding target and causes the imaging element to acquire an image of the predetermined pattern of the bonding target as a first pattern image,illuminates the bonding target through a second optical path inclined with respect to the first optical path and causes the imaging element to acquire the image of the predetermined pattern of the bonding target as a second pattern image, andcalculates an amount of variation from a reference height of the bonding target on the basis of an positional offset amount between the first pattern image and the second pattern image.

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