BONDING DEVICE AND METHOD FOR DETECTING HEIGHT OF SUBJECT

• US 20200132438A1
• Filed: 07/27/2017
• Published: 04/30/2020
• Est. Priority Date: 11/24/2016
• Status: Active Grant

• Current Assignee: Shinkawa Ltd. (Yamaha Corporation)
• Original Assignee: Shinkawa Ltd. (Yamaha Corporation)
• Inventors: HAYATA, Shigeru, TOMIYAMA, Hiromi
• Granted Patent: US 10,816,322 B2
• Time in Patent Office: Days
• CPC Class Codes: G01B 11/0608 Height gauges
• CPC Class Codes: G01B 11/0625 with measurement of absorption or reflection
• CPC Class Codes: G02B 7/28 Systems for automatic generation of focusing signals
• CPC Class Codes: G06T 2207/10152 Varying illumination
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/75745 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75753 Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/759 Means for monitoring the connection process
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H04N 23/56 provided with illuminating means

Abstract

A bonding apparatus having an optical system, an imaging element for acquiring an image formed by the optical system as a picture, an illumination unit for illuminating an electronic component, and a control part for processing the image acquired by the imaging element, the control part illuminating the electronic component through a first inclined optical path inclined with respect to the optical axis of a first portion of the optical system facing the electronic component and acquiring a first image, illuminating the electronic component through a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis and acquiring a second image of the electronic component as a subject, and calculating an amount of variation from a reference height of the electronic component on the basis of the positional offset amount between the first image and the second image.

Claims

1. A bonding apparatus comprising:

an optical system that forms an image of a bonding target having a predetermined pattern;

an imaging element that acquires the image formed by the optical system as a picture;

an illumination unit that includes a plurality of light sources and illuminates the bonding target through an optical path of the optical system; and

a control part that processes the image acquired by the imaging element,

wherein the control part illuminates the bonding target through a first optical path of the optical system facing the bonding target and causes the imaging element to acquire an image of the predetermined pattern of the bonding target as a first pattern image,

illuminates the bonding target through a second optical path inclined with respect to the first optical path and causes the imaging element to acquire the image of the predetermined pattern of the bonding target as a second pattern image, and

calculates an amount of variation from a reference height of the bonding target on the basis of an positional offset amount between the first pattern image and the second pattern image.

2. The bonding apparatus according to claim 1,

wherein

the control part illuminates the bonding target through the first optical path by turning on a first light source disposed at a first position within the illumination unit and turning off other light sources and causes the imaging element to acquire the first pattern image, and

illuminates the bonding target through the second optical path by turning on a second light source disposed at a second position different from the first position and turning off other light sources and causes the imaging element to acquire the second pattern image.

3. The bonding apparatus according to claim 1,

wherein the first optical path is a first inclined optical path inclined with respect to an optical axis of a first portion of the optical system facing the bonding target,

the second optical path is a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis of the first portion,

and

the control part illuminates the bonding target through the first inclined optical path by turning on a first light source disposed at a first position eccentric from the optical axis of the first portion within the illumination unit and turning off other light sources and causes the imaging element to acquire the first pattern image, and

illuminates the bonding target through the second inclined optical path by turning on a second light source disposed at a second position on the opposite side of the first position with respect to the optical axis of the first portion and turning off other light sources and causes the imaging element to acquire the second pattern image.

4. The bonding apparatus according to claim 1,

wherein the first optical path is a vertical optical path along an optical axis of a first portion of the optical system facing the bonding target,

the second optical path is a second inclined optical path inclined with respect to the optical axis of the first portion,

and

the control part illuminates the bonding target through the vertical optical path by turning on a first light source disposed coaxially with the optical axis of the first portion within the illumination unit and turning off other light sources and causes the imaging element to acquire the first pattern image, and

illuminates the bonding target through the second inclined optical path by turning on a second light source disposed at a second position separated from the optical axis of the first portion and turning off other light sources and causes the imaging element to acquire the second pattern image.

5. The bonding apparatus according to claim 1,

wherein the first optical path is a first inclined optical path inclined with respect to an optical axis of a first portion of the optical system facing the bonding target,

the second optical path is a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis of the first portion,

the bonding apparatus includes a shielding plate that is rotatable around the optical axis of the first portion and provided with a hole for transmitting light from the illumination unit and eccentric from a center, the center being coaxial with the optical axis of the first portion of the optical system, and

the control part causes the hole to locate at a first position eccentric from the optical axis of the first portion when the illumination unit is turned on and the first pattern image is acquired, and to locate the hole at a second position on the opposite side of the first position with respect to the optical axis of the first portion when the second pattern image is acquired.

6. The bonding apparatus according to claim 1,

wherein the first optical path is a first inclined optical path inclined with respect to an optical axis of a first portion of the optical system facing the bonding target,

the second optical path is a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis of the first portion,

the optical system includes a lens and a diaphragm disposed between the lens and the imaging element, and

the diaphragm has an opening allowing passage of reflected light with which the bonding target is illuminated through the first inclined optical path or the second inclined optical path at a position eccentric from an optical axis of a second portion passing through the diaphragm of the optical system.

7. The bonding apparatus according to claim 6,

wherein the diaphragm is rotatable around the optical axis of the second portion, and

the control part sets the position of the opening to a position allowing passage of reflected light with which the bonding target is illuminated through the first inclined optical path when the first pattern image is acquired by the imaging element, and sets the position of the opening to a position allowing passage of reflected light with which the bonding target is illuminated through the second inclined optical path when the second pattern image is acquired by the imaging element.

8. The bonding apparatus according to claim 1, wherein the optical system is a telecentric optical system.

9. A method for calculating an amount of variation from a reference height of a bonding target having a predetermined pattern, the method comprising:

preparing an imaging apparatus including an optical system that forms an image of the bonding target, an imaging element that acquires the image formed by the optical system as a picture, an illumination unit that includes a plurality of light sources and illuminates the bonding target through an optical path of the optical system, and a control part that processes the image acquired by the imaging element;

illuminating the bonding target through a first optical path of the optical system facing the bonding target and causing the imaging element to acquire an image of the predetermined pattern of the bonding target as a first pattern image;

illuminating the bonding target through a second optical path inclined with respect to the first optical path and causing the imaging element to acquire the image of the predetermined pattern of the bonding target as a second pattern image; and

calculating an amount of variation from a reference height of the bonding target on the basis of an positional offset amount between the first pattern image and the second pattern image.

10. The method for calculating an amount of variation from a reference height of a bonding target having a predetermined pattern according to claim 9,

wherein the first optical path is a first inclined optical path inclined with respect to an optical axis of a first portion of the optical system facing the bonding target,

the second optical path is a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis of the first portion, and

the method further comprising:

illuminating the bonding target through the first inclined optical path by turning on a first light source disposed at a first position eccentric from the optical axis of the first portion within the illumination unit and turning off other light sources and causing the imaging element to acquire the first pattern image; and

illuminating the bonding target through the second inclined optical path by turning on a second light source disposed at a second position on the opposite side of the first position with respect to the optical axis of the first portion and turning off other light sources and causing the imaging element to acquire the second pattern image.

11. The method for calculating an amount of variation from a reference height of a bonding target having a predetermined pattern according to claim 9,

wherein the first optical path is a first inclined optical path inclined with respect to an optical axis of a first portion of the optical system facing the bonding target,

the second optical path is a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis of the first portion,

the optical system includes a lens and a diaphragm disposed between the lens and the imaging element,

the diaphragm has an opening allowing passage of reflected light with which the bonding target is illuminated through the first inclined optical path or the second inclined optical path at a position eccentric from an optical axis of a second portion passing through the diaphragm of the optical system, and is rotatable around the optical axis of the second portion,

the position of the opening is set to a position allowing passage of reflected light with which the bonding target is illuminated through the first inclined optical path when the first pattern image is acquired by the imaging element, and

the position of the opening is set to a position allowing passage of reflected light with which the bonding target is illuminated through the second inclined optical path when the second pattern image is acquired by the imaging element.