TEMPERATURE SENSOR DEVICE

• US 20200132553A1
• Filed: 06/17/2019
• Published: 04/30/2020
• Est. Priority Date: 10/24/2018
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: KISHIMOTO, Hiroyuki
• Granted Patent: US 11,402,274 B2
• Time in Patent Office: Days
• CPC Class Codes: G01K 1/08 Protective devices, e.g. casings
• CPC Class Codes: G01K 1/10 for preventing chemical attack
• CPC Class Codes: G01K 2205/02 for measuring inlet gas temperature
• CPC Class Codes: G01L 19/0092 Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26
• CPC Class Codes: G01L 9/0054 integral with a semiconducting diaphragm

Abstract

To obtain a temperature sensor device having high reliability and high sensitivity without cost increase. This temperature sensor device includes: a housing provided with a temperature sensor module having a temperature detection element and an external connection terminal connected to the temperature detection element via a lead wire, which are integrated using a first formation member made from a thermoplastic resin, the temperature sensor module being covered with a second formation member made from a thermoplastic resin, so as to form a connector for connecting the external connection terminal to an external signal processing circuit; and a case into which the temperature sensor module is press-fitted and which is opposed to the housing, wherein the first formation member and the second formation member are welded to each other.

Claims

1. A temperature sensor device comprising:

a housing provided with a temperature sensor module having a temperature detection element and an external connection terminal connected to the temperature detection element via a lead wire, which are integrated using a first formation member made from a thermoplastic resin, the temperature sensor module being covered with a second formation member made from a thermoplastic resin, so as to form a connector for connecting the external connection terminal to an external signal processing circuit; and

a case into which the temperature sensor module is press-fitted, the case being provided so as to be opposed to the housing, wherein

the first formation member and the second formation member are welded to each other.

2. The temperature sensor device according to claim 1, wherein

the temperature sensor module has a flange protruding therearound and made from the first formation member, and

the flange and the second formation member are welded to each other.

3. The temperature sensor device according to claim 1, wherein

the first formation member forming the temperature sensor module is formed so as to be thinned toward an end of the temperature sensor module.

4. The temperature sensor device according to claim 2, wherein

the first formation member forming the temperature sensor module is formed so as to be thinned toward an end of the temperature sensor module.

5. The temperature sensor device according to claim 1, wherein

the case has a storage chamber into which the temperature sensor module is press-fitted, and

a part of the first formation member is held by pressing an inner wall of the storage chamber.

6. The temperature sensor device according to claim 2, wherein

the case has a storage chamber into which the temperature sensor module is press-fitted, and

a part of the first formation member is held by pressing an inner wall of the storage chamber.

7. The temperature sensor device according to claim 3, wherein

the case has a storage chamber into which the temperature sensor module is press-fitted, and

a part of the first formation member is held by pressing an inner wall of the storage chamber.

8. The temperature sensor device according to claim 4, wherein

the case has a storage chamber into which the temperature sensor module is press-fitted, and

a part of the first formation member is held by pressing an inner wall of the storage chamber.

9. The temperature sensor device according to claim 5, wherein

the temperature detection element is exposed from an opening at an end of the storage chamber formed in the case.

10. The temperature sensor device according to claim 6, wherein

the temperature detection element is exposed from an opening at an end of the storage chamber formed in the case.

11. The temperature sensor device according to claim 7, wherein

the temperature detection element is exposed from an opening at an end of the storage chamber formed in the case.

12. The temperature sensor device according to claim 8, wherein

the temperature detection element is exposed from an opening at an end of the storage chamber formed in the case.

13. The temperature sensor device according to claim 9, wherein

at the opening, pillars are formed so as to surround the exposed temperature detection element.

14. The temperature sensor device according to claim 10, wherein

at the opening, pillars are formed so as to surround the exposed temperature detection element.

15. The temperature sensor device according to claim 11, wherein

at the opening, pillars are formed so as to surround the exposed temperature detection element.

16. The temperature sensor device according to claim 12, wherein

at the opening, pillars are formed so as to surround the exposed temperature detection element.

17. The temperature sensor device according to claim 13, wherein

the pillars protrude more than the exposed temperature detection element.

18. The temperature sensor device according to claim 1, wherein

the housing is provided with a pressure sensor, and

the case has a pressure introduction hole at a position opposed to the pressure sensor.