DEVICE AND METHOD FOR TESTING SEMICONDUCTOR DEVICE AND TEST HANDLER

• US 20200132753A1
• Filed: 05/10/2019
• Published: 04/30/2020
• Est. Priority Date: 10/24/2018
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: LIM, TAE YOUN
• Granted Patent: US 11,243,247 B2
• Time in Patent Office: Days
• CPC Class Codes: G01R 1/0466 concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: G01R 31/2867 Handlers or transport devices, e.g. loaders, carriers, trays

Abstract

A device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors.

Claims

1. A device for testing a semiconductor device, comprising:

a blade comprising one or more outer blade conductors disposed on one or more side surfaces of the blade;

a socket comprising one or more outer socket conductors disposed on one or more side surfaces of the socket,

wherein the one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade; and

a test board that transfers a test signal to the one or more outer socket conductors.

2. The device of claim 1, further comprising:

a test signal providing circuit that provides a test signal to the test board while the blade is moved from a first position to a second position; and

a test signal detecting circuit that detects whether the test signal provided from the test signal providing circuit reaches the one or more outer blade conductors.

3. The device of claim 2,

wherein the blade has a cross-sectional surface having a rectangular shape taken in a direction perpendicular to a direction in which the blade is moved from the first position to the second position,

wherein the one or more outer blade conductors are formed on at least two or more edges among four edges forming the rectangular shape or on two or more corners among four corners forming the rectangular shape.

4. The device of claim 1,

wherein each of the one or more outer socket conductors comprises a first sub-conductor and a second sub-conductor isolated from each other,

wherein the first sub-conductor receives a test signal from the test board, and the second sub-conductor provides the test signal to the test board.

5. The device of claim 4,

wherein the test board comprises one or more test signal transferring portions, each comprising a signal transmitting conductor and a signal receiving conductor,

wherein the signal transmitting conductor transmits the test signal to the one or more outer socket conductors, and the signal receiving conductor receives the test signal from the one or more outer socket conductors.

6. The device of claim 5, further comprising:

a test signal providing circuit that provides the test signal to the signal transmitting conductor while the blade is moved from a first position to a second position; and

a test signal detecting circuit that detects whether the test signal provided from the test signal providing circuit reaches the signal receiving conductor.

7. The device of claim 1, wherein the one or more outer blade conductors are selectively removable from the blade.

8. The device of claim 1,

wherein the one or more outer blade conductors comprise first to Mth outer blade conductors,

wherein the one or more outer socket conductors comprise first to Mth outer socket conductors,

wherein the test board comprises first to Mth test signal transferring portions that transfer the test signal to or receive the test signal from the first to Mth outer socket conductors,

wherein M is an integer equal to or greater than 2.

9. The device of claim 8, wherein each of the first to Mth test signal transferring portions comprises a signal transmitting conductor that transmits the test signal to the first to Mth outer socket conductors, and a signal receiving conductor that receives the test signal from the first to Mth outer socket conductors.

10. The device of claim 9, further comprising:

a test signal providing circuit that provides the test signal to the test board while the blade is moved from a first position to a second position; and

a test signal detecting circuit that detects whether the test signal provided from the test signal providing circuit reaches the one or more outer blade conductors.

11. The device of claim 10,

wherein the signal transmitting conductor of the first test signal transferring portion is electrically connected to the test signal providing circuit,

wherein the signal receiving conductor of the M−

1th test signal transferring portion is electrically connected to the signal transmitting conductor of the Mth test signal transferring portion,

wherein the signal receiving conductor of the Mth test signal transferring portion is electrically connected to the test signal detecting circuit.

12. The device of claim 10,

wherein the signal transmitting conductors of the first to Mth test signal transferring portions are electrically connected to the test signal providing circuit,

wherein the signal receiving conductors of the first to Mth test signal transferring portions are electrically connected to the test signal detecting circuit.

13. A test handler, comprising:

a blade movable from a first position to a second position; and

one or more outer blade conductors formed on at least one side surface of the blade,

wherein, while the blade is moved from the first position to the second position, the one or more outer blade conductors indicate whether a test process is continued, depending on whether a test signal is transferred from one or more outer socket conductors formed on outer regions of a socket.

14. The test handler of claim 13, wherein the test signal provided to the outer socket conductors is provided from a test board.

15. The test handler of claim 14, further comprising:

a test signal detecting circuit that detects whether the test signal reaches the one or more outer blade conductors.

16. The test handler of claim 14, further comprising:

a test signal detecting circuit that detects whether, after the test signal provided to the one or more outer socket conductors reaches the outer blade conductors, the test signal passes through the one or more outer socket conductors again and reaches the test board.

17. The test handler of claim 13, wherein the one or more outer blade conductors are selectively removable from the blade.

18. A method of testing a semiconductor device, comprising:

a first process of moving a blade comprising one or more outer blade conductors disposed on one or more side surfaces of the blade from a first position to a second position;

a second process of determining whether a test signal is transferred from one or more outer socket conductors formed on one or more outer regions of a socket to the one or more outer blade conductors; and

a third process of determining whether an error is detected based on whether the test signal is transferred from the one or more outer socket conductors to the one or more outer blade conductors.

19. The method of claim 18, further comprising:

a fourth process of transferring the test signal to the one or more outer socket conductors by a test board before the second process.

20. The method of claim 19, wherein the second process further comprises a fifth process of determining whether, after the test signal provided to the one or more outer socket conductors from the test board reaches the one or more outer blade conductors, the test signal passes through the one or more outer socket conductors again and is transferred to the test board.